MD-0063 PLUS Miniature Thermoelectric Coolers Assembly Machine , China MD-0063 PLUS Miniature Thermoelectric Coolers Assembly Machine Manufacturers, Suppliers, Factory

MD-0063 PLUS Micro Thermoelectric Cooler (TEC) Assembly Machine

This machine is a high-precision assembly system specifically designed for semiconductor thermoelectric coolers.

The AX-0063 PLUS high-precision TEC assembly machine consists of several integrated modules:

1. A custom direct-drive die-bonding head with a 360° rotatable nozzle.

2. A die-pickup stage controlled by a linear motor and a high-precision magnetic linear encoder.

3. A 2-megapixel vision system for precise positioning.

4. An assembly stage equipped with a linear motor and a high-precision optical linear encoder.

5. An automated loading and unloading system for carriers.

6. A magazine-style feeding mechanism.

7. A downward-looking CCD camera for angular correction of the die held by the nozzle.

Equipment Performance Features:

1.High Speed: Achieves industry-leading speeds tailored to specific customer process requirements.

2.High Precision: Delivers industry-leading accuracy (for photolithography masks + chips) based on customer process requirements.

3.Angular Accuracy: ±0.2°

4.Placement Accuracy: ±10µm

5.Adjustable Pressure: 30g to 200g

6.Linear Bonding Head (with 360° rotatable nozzle)

7.Versatile Vision-Based Positioning (supports outline, feature point, edge detection, and circle detection)

8.CPK Quality Monitoring and Tracking

9.In-line Configuration: Supports multi-unit serial processing for device packaging

10.Direct-Drive Flip-and-Pick Mechanism

Equipment Structure:

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Equipment dimensions:

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Workflow:

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Introduction to 3-Axis Customization:

1.This three-axis linear bonding head is a custom-designed, high-speed unit capable of motion in the X, Y, and Z directions.

2.The bonding nozzle features integrated angle correction and pressure control functions.

3.Angle control is managed by a direct-drive (DD) motor with a resolution of 0.0025°.

4.The XYZ-axis repeatability is ±2 µm.

Retrieve the die-bonding lens barrel:

1.Equipped with a 2-megapixel CCD positioning sensor and PCB board;

2.Features a high-definition microscope and a high-brightness light source;

3.Image recognition accuracy: ±2μm

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Downward-looking vision system:

1.Utilizes a 2-megapixel CCD to locate the bottom of the component, with a rotating suction nozzle used for angular alignment.

2.Equipped with a high-definition microscope and a high-brightness light source.

3.Image recognition accuracy: ±2μm

Loading station and carrier:

1.The X and Y axes utilize linear motors combined with high-precision magnetic linear encoders for control;

2.Repeat positioning accuracy for the X and Y axes is ±2 µm.

Unloading station and carrier:

1.The X-axis of the worktable is controlled by a linear motor combined with a high-precision magnetic scale;

2.X-axis repeatability: ±2 µm

Monitoring CCD:

1.Utilizes a 4K high-definition CCD and an FA lens for real-time monitoring of results;

2.Facilitates equipment setup and calibration.

Technical Specifications:

UPH	≥ 800 pcs (for ceramic components)
Placement accuracy (X, Y axes)	±10um （1.5~5mm）
Placement angle accuracy	±0.2° (1.5~5mm)
Placement force range and accuracy	30~200g ±10%
Feeding method	Magazine/Tray
Maximum camera accuracy	1 µm (combined vision accuracy)
Compatible die/chip size	1.5mm-10mm
Camera field of view (FOV)	2.1mm~14mm
Number of nozzles	1PCS
Number of soft-vibration (soft-touch) units	1PCS
Materials to be assembled	Ceramic components and other electronic materials
Assembly stage size range	Width:77mm；Length:70mm
Worktable height	950mm±30mm
Power supply	AC 220V/50Hz
Power consumption	900 W
Compressed air	0.4~0.6Mpa
External dimensions (W × D × H) (excluding loading/unloading units)	115012401950mm
Net weight	1100 Kg

Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.

Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.

Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.

Please contact our engineers for detailed information regarding specific equipment.

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MD-0063 PLUS Miniature Thermoelectric Coolers Assembly Machine

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