MD-0064L High-Precision Die-Placement Machine
The MD-0064L high-precision die-placement machine consists of several modular sub-units:
1. Custom direct-drive die-bonding head with 360° nozzle rotation.
2. Die-pickup stage controlled by a linear motor and a high-precision magnetic linear scale.
3. Vision system with 1.3-megapixel resolution for precise positioning.
4. Placement stage equipped with a linear motor and a high-precision magnetic linear scale.
5. Integrated in-line mode for carrier (wafer frame/ring) loading and unloading.
6. Downward-looking CCD camera for angular correction of the die held on the nozzle.
7. Automatic ring-exchange system for 8-inch wafer frames (outer and inner rings).
Equipment Performance Features:
Equipment Structure:
Equipment dimensions:
Workflow:
Introduction to Custom 3-Axis Worktables:
Assembly workstation and carriers:
Technical Specifications:
UPH |
0.5–2K (depending on actual materials) |
Placement positional accuracy (X, Y) |
±15µm (for ceramic components ≤5mm); ±25µm (for ceramic components ~10mm) |
Placement angular accuracy |
±1° |
Placement force range and precision |
30–200g (±10% tolerance) |
Loading/unloading method |
Inline mode |
Maximum camera resolution/accuracy |
2µm (combined vision accuracy) |
Compatible die/chip sizes |
3mm-12mm |
Camera field of view (FOV) |
5mm~20mm |
Number of pickup nozzles |
1PCS |
Die stage travel range |
8-inch wafer ring (frame and insert ring) |
Materials to be bonded/assembled |
Ceramic components, semiconductor chips, or electronic components in trays |
Placement stage size range |
Width:77mm; Length:100mm |
Operator console height |
900mm±30mm |
Power supply |
AC 220V/50Hz |
Power consumption |
900 W |
Compressed air |
0.4~0.6Mpa |
External dimensions (W × D × H) (excluding loading/unloading units) |
1300*1250*1950mm |
Net weight |
1200 Kg |
Application of various vision algorithms:
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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