Model: MD-0061 PLUS
This high-precision die bonder is specifically designed for semiconductor thermoelectric coolers (TECs).
High-precision Die Bonder Specifically Designed for
Semiconductor Thermoelectric Coolers ( TEC )
It is a high-precision, "soft-vibration" (gentle-vibration) die bonder, composed of several modular sub-units:
1. A custom, direct-drive 3-axis bonding head with 360° nozzle rotation.
2. A worktable controlled by linear motors.
3. A 1.3-megapixel vision system for precise positioning.
4. A bonding stage equipped with a high-precision linear motor.
5. An automated carrier loading and unloading system.
6. A bulk material feeding system utilizing a "soft-vibration" (gentle-vibration) bowl feeder.
7. A downward-looking CCD camera for angular correction of the chip held by the nozzle.
8. A customized, high-speed 3-axis bonding head assembly.
Equipment Performance Features:
Equipment Structure Overview (Configuration of 2 individual units):
External dimensions of the equipment (combination of two individual units):
Workflow (Configuration of 2 standalone units):
Equipment Layout:
Introduction to a custom 3-axis bonding head workstation:
The linear motor stators are fixed in place, resulting in a compact design with low load.
The voice coil motor is primarily used to control the pressure applied by the nozzle. Pressure adjustment range: 30g to 300g.
The rotary motor is primarily used to control the rotation of the nozzle (360°).
It utilizes a high-precision motor control system.
Technical Specifications (Configuration of 2 individual units):
UPH |
14K (for chips/components) |
X, Y placement positional accuracy |
±15um |
Placement angular accuracy |
±1° |
Placement force range and accuracy |
30~300g ±10% |
Particle/component feeding |
Bulk component feeding via gentle vibration |
Maximum camera resolution/accuracy |
1.2um |
Camera field of view (FOV) |
4.0mm~25mm |
Number of placement nozzles |
4PCS |
Number of soft-touch/low-impact units |
2PCS |
Materials to be placed |
Semiconductor thermoelectric cooler (TEC) components |
Placement stage size range |
Width:77mm；Length:75mm |
Worktable height |
900mm±30mm |
Power supply |
AC 220V/50Hz |
Power consumption |
1200 W |
Compressed air |
4~6 Bar |
External dimensions (W×D×H) (excluding loading/unloading units) |
2100*1035*1900mm |
Net weight |
1800 Kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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