The shape of our Wafer saw makes it easier to slice soft, delicate wafers. Great Job: It manages to avoid breaking or crumbling them, something many bakers have a hard time with. Goodbye to ripped slices and the annoyance of uneven sections, hello every time you bake with perfectly cut wafers.
The wafer slicer from Minder-Hightech is the perfect device, for the slicing of wafers. Plus, it comes with adjustable settings that can be changed to help you decide how thick or thin your slices should be. This means you can be confident that same amount of slice will come out which is very important in baking.
The Wafer dicing is one of chefs best time saving devices and ensures every slice is even. Even more so when you are constructing layered desserts (like ANY trifle), and a SMOOTH cut is mandatory to be successful. When your slices are not uniform, then you might end up without a good looking and tasting dessert
With a slicer, you can set the cutting blade to the stone size. Thus, the sheets will be perfectly even and you know how important that is in making delicacies like crepes or mille-feuille! If your sliver is not so thin, the dessert will be destroyed and it will no longer be tasty, hence continue to keep an Master Graterazor blade.

If you want to elevate your baking game, a wafer slicer is an indispensable tool in your kitchen. And what a great tool this is, it can make wafer sheets that are sharply sliced and you will be able to prepare an amazing dessert with these well cut slices.

You can make desserts that look like they were professionally baked and impress everyone in your family! Whether you are shaping a classic napoleon, or a modern entremet, the wafer slicer will bring that perfection easily.

Just adjust your cutting blade to the desired thickness, place the head of the wafer on one end of your slicer and with a gentle pull you have a perfect slice. It’s really that easy! On top of that, the slicer is dishwasher safe and a great space-saver in your kitchen.
Minder-Hightech is a service and sales representative for electronic and wafer slicer manufacturing equipment. Our experience with sales of equipment stretches over 16 years. The company is dedicated to providing its customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
Minder-Hightech is now a very well-known brand in the industrial world, based on decades of experience with machine solutions and good relationship with oversea customers of Minder Hightech, we wafer slicer "Minder-Pack" which focuses on the manufacturing of packages solution, as well as other high value machines.
Our primary products are: wafer slicer, Wire bonder Dicing Saw, Plasma surface treatment Photoresist removal machine Rapid Thermal Processing, RIE, PVD, CVD, ICP, EBEAM, Parallel sealing welder, Terminal insertion machine, Caparitar winding machines, Bonding tester, etc.
Minder Hightech is wafer slicer by a group of high educated experts, skilled engineers and staff, who have impressive professional skills and expertise. Our brand's products have been introduced to many industrialized countries around the world to help customers increase efficiency, reduce costs, and increase product quality.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved