Model: MD-580
Applicable products: Suitable for ceramic tiles with specifications ranging from 20 to 50
Accuracy:+38 μ m
MD-580 Assembly Machine for Thermoelectric Coolers (TEC)

Applicable products: Suitable for ceramic tiles with specifications ranging from 20 to 50
Accuracy:+38 μ m
Features:
1. Applicable to the lamination of ceramic chips ranging from Size 20 to Size 50;
2. Key functions include chip loading and printing, dual-channel 3D inspection, flip-and-stack lamination, loading onto positioning fixtures, and defective product collection;
3. Throughput: 100 fixtures (each fixture accommodates 4 to 12 ceramic chips);
4. Positioning Accuracy: ±25 µm to ±38 µm (excluding chip-specific tolerances);
5. Frame Dimensions: Length ≤ 130 mm, Width ≤ 90 mm;
6. Vision System: High-precision, adjustable image recognition and positioning system.
Parameters:
Technical Specifications |
Parameter Specifications |
Hourly Throughput |
80–100pcs Fixtures |
Positioning Accuracy |
±38 µm |
Solder Paste Volume |
<±15% |
Solder Paste Inspection Accuracy |
<±3 million |
3D Inspection Imaging |
Detects missing, tilted, misaligned, or damaged NP particles, etc. |
Panel Size Range |
Width: 89 mm; Length: 127 mm |
Upstream/Downstream Equipment Interface |
SMEMA |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
1000 W |
Compressed Air |
5–6 bar |
Dimensions (W × D × H) |
2030 × 1700 × 1650 mm (Excluding Loader) |
Net Weight |
1300 kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
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