Used for deflash after the molding process of semiconductor IC , LED, TO, SOT, QFN, DFN etc…



length |
140-245mm |
width |
50-80mm |
thickness |
0.2-3mm |
MDWF-CDA8030(Chemical Deflash) |
Automatic upload >>chemical immerse>>bubble cleaning(optional ultrasonic cleaning)>>download |
MDWF-WJ8030(water jet) |
Automatic upload>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download |
MDWF-EDWJ8030(Electrolysis Deflash + Water Jet) |
Automatic upload>>Electrolysis deflash>>water jet>>ultrasonic cleaning>>spray drying>>oven drying>>download |






Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved