Wafer Scribe and Break Equipment
Suitable for specialized equipment for cutting and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. with a diameter of less than 4 inches.
Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.
Dry Process Dicing:
Wafer Scriber Breaker / Wafer Scribe and Break Equipment
Suitable for specialized equipment for cutting and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. with a diameter of less than 4 inches. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.
Cutting head |
X direction |
Travel range: 120mm |
Roller pressure |
0~100gf |
Positioning accuracy: 5 μ m |
Knife pressure |
0~20gf |
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Y direction |
Travel range: 100mm |
Equipment weight |
About 60kg |
|
Positioning accuracy: ±5 μ m |
Lens Y direction |
Travel range:650*650*400mm |
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T direction |
360 degree rotation |
External dimensions |
1170mmx730 mmx500mm |
|
Wafer size |
Suitable for 4-inch (100mm) wafers |
Operation interface |
19.5 "TFT color screen, Chinese interface |
|
Image system |
6.0X magnification (4.0X optional) |
Control system |
Windows 7 operating system, dedicated control software for cleavage machines |
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Standard configuration |
Host \ Computer \ 19.5 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard |
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FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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