Wafer Cleaving Machine

Dry Process Dicing:

Wafer Cleaving Machine

Suitable for specialized equipment for cutting and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. with a diameter of less than 4 inches. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.

Application:

Application of III-V compound semiconductor materials, GaAS/II-V RFIC, Bio-Medical Chips, Silicon/MEMS, Sl Photonics, LEDS, Laser Diodes.

Features:

Low COO, Robust Platform;

High Precision Positioning;

Vibration Free Stage Design;

Automatic Processing;

Advanced Software Functions;

Accommodates Multiple Break/Process Modules.

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.