


Wafer size |
4”~ 8” wafer |
Wafer thickness |
100~750 microns |
Wafer type |
Si, SiC, GaN, or other materials |
Film type |
Blue film, UV film Width: 230 ~ 300 mm Length: 100 m Thickness: 0.05 ~ 0.2 mm |
Wafer carrier ring |
6”、8”DISCO |
Loading and unloading method |
Manual wafer/carrier ring placement and removal |
Film positioning accuracy |
±0.5mm Standard 6” and 8” wafer plates for 6” and 8” wafers |
Vacuum pump |
Minder-Hightech |
Antistatic control |
Deionization fan |
Control unit |
Based on PLC control, with 10” touch screen |
Safety protection |
Configured with light curtain protection and emergency stop button |
Power supply voltage |
Single-phase AC 220V, 16A |
Compressed air |
0.45~0.6MPa, flow rate 70L/min |
Machine housing |
White plastic-sprayed metal housing |
Volume |
850mm (width)*1750mm (depth)*1970mm (height) |
Net weight |
480kg |


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