Thermo Electric Cooler（TEC）Automatic Die Bonder , China Thermo Electric Cooler（TEC）Automatic Die Bonder Manufacturers, Suppliers, Factory

Products Description

Thermo Electric Cooler（TEC）Automatic Die Bonder

Specification

360i-8 inch Die bonder Technical specification
Solid Crystal Worktable (Linear Module)	Optics System
Worktable stroke100x300mm	Camera
Resolution1μm	Optics Magnifier (wafer) 0.7 times to 4.5 times 0.7~4.5
Die Workbench (Linear Module)	Cycle Time200MS/EA
XY stroke8"*8"	Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k; 12k
Resolution1μm
Wafer placement accuracy	Loading and unloading module
Adhesive die position x-y±2mil	Use vacuum sucker to automatically feed
Rotation accuracy±3°	Use box cartridge receipt to unloading
	Pneumatic plate clamp, bracket width adjustment range of 25 ~ 90mm 25~90mm
Dispensing module	Equipment Require
Swing arm dispensing + heating system	VoltageAC220V/50HZ
Dispensing needle set can be exchanged by single or multiple needle	Air Source minimum 6BAR
	Vacuum Source700mmHG(Vacuum pump)

PR System	Dimensions And Weight
Method256 grey levels	Weight450kg
Detectionink/chipping/cracked die	Size(Dx Wx H)12009001500mm
Monitor17"LCD
Monitor Resolution1024*768	Missing Die
	Vacuum Sensor

380-12 inch Die Bonder Technical Specifications
Fixation worktable (linear module)			Fixation worktable (linear module)
		Camera
Worktable travel 100x300mm	Worktable travel 100x300mm	Optical magnification (crystal element) 0.7x~4.5x
Resolution 1 u m			Resolution 1 u m
Wafer worktable (linear module)	Wafer worktable (linear module)	The solidification period is less than 250 milliseconds, and the production capacity is greater than 12k;
XY travel 12”*12	XY travel 12”*12
Resolution 1 um			Resolution 1 um
Wafer placement accuracy	Wafer placement accuracy	Automatic feeding method using vacuum suction cups for feeding
Glue position x-y ±2mil Rotation accuracy ±3°	Glue position x-y ±2mil Rotation accuracy ±3°	Material box container type material collection is used for material cutting
Glue position x-y ±2mil Rotation accuracy ±3°	Glue position x-y ±2mil Rotation accuracy ±3°			Using pneumatic pressure plate fixtures, the width adjustment range of the bracket is 25~90mm

Glue dispensing module			Glue dispensing module
Use swing arm glue dispensing + heating system			Use swing arm glue dispensing + heating system

Glue dispensing needle group can be interchanged with single needle or multi-needle			Glue dispensing needle group can be interchanged with single needle or multi-needle

PR System			PR System
Method: 256 grey levels			Method: 256 grey levels
Monitor 17"			Monitor 17"
Monitor Resolution: 1024*768			Monitor Resolution: 1024*768

The equipment is customized according to your needs

Equipment Overview:

the equipment will be customized according to your needs.

Name	Application	Mounting accuracy
High-precision semiconductor Die Bonder	High-precision optical modules, MEMS and other planar products	±5 µm
Fully automatic Eutectic Machine for optical devices	TO9, TO56, TO38, etc	±10 µm
Flip Chip Die bonding machine	Use flip-chip packaging products	±30 µm
Automatic TEC Die bonder	TEC cooler particle patch	±10 µm
High-precision Die bonder	PD, LD, VCSEL, Mic /Min TEC, etc	±10 µm
Semiconductor Die sorter	Wafer, LED beads, etc	±25 µm
High-speed sorting and arranging machine	Blue film chip sorting and filming	±20 µm
IGBT Chip Mounter	Driver module, integration module	±10 µm
Online dual-head high-speed Die bonding machine	Chip, capacitor, resistor, discrete chip and other surface-mount electronic components	±25 µm

Equipment Real Shoots

Packing & Delivery

Company Profile

Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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Thermo Electric Cooler（TEC）Automatic Die Bonder

Thermo Electric Cooler（TEC）Automatic Die Bonder

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Thermo Electric Cooler（TEC）Automatic Die Bonder

Thermo Electric Cooler（TEC）Automatic Die Bonder

Equipment Overview:

More Products

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Products

Get In Touch

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