project |
Specifications |
remarks |
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1 |
Equipment Overview |
Equipment name: Fully auto uniform glue developing machine |
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Equipment model: MD-2C2D6 |
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Processing wafer specifications: compatible with 4/6-inch standard wafers |
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Process flow of uniform glue: Flower basket slicing → centering → uniform glue (dripping → uniform glue → edge removal, back washing) → hot plate → cold plate → basket placing Development process flow: Flower basket slicing → centering → development (development solution → deionized water, back washing → nitrogen drying) → hot plate → cold plate → basket placing |
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Overall size (approximately): 2100mm (W) * 1800mm (D) * 2100mm (H) |
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Chemical cabinet size (approximately): 1700(W) * 800(D) * 1600mm (H) |
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Total weight (approximately):1000kg |
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Workbench height: 1020 ± 50mm |
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2 |
Cassette unit |
Quantity: 2 |
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Compatible size: 4/6 inches |
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Cassette detection: microswitch detection |
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Slide out detection: Yes, reflective sensor |
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3 |
robot |
Quantity: 1 |
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Type: Double arm vacuum adsorption robot |
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Degree of freedom: 4-axis (R1, R2, Z, T) |
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Finger material: ceramic |
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Substrate fixation method: vacuum adsorption method |
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Mapping function: Yes |
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Positioning accuracy: ± 0.1mm |
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4 |
Centering unit |
Quantity: 1 set |
Optional optical alignment |
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Alignment method: mechanical alignment |
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Centering accuracy: ± 0.2mm |
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5 |
Uniform glue unit |
Quantity: 2 sets (the following are configurations for each unit) |
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Spindle rotation speed: -5000rpm~5000rpm |
carrying idler |
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Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm) |
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Minimum adjustment of spindle rotation speed: 1rpm |
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Maximum acceleration of spindle rotation: 20000rpm/s |
carrying idler |
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Dripping arm: 1 set |
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Photoresist tube route: 2 routes |
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Photoresist nozzle diameter: 2.5mm |
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Photoresist insulation: 23 ± 0.5 ℃ |
optional |
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Moisturizing nozzle: Yes |
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RRC: Yes |
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Buffer: Yes, 200ml |
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Glue dropping method: center dropping and scanning dropping are optional |
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Edge removal arm: 1 set |
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Edge removal nozzle diameter: 0.2mm |
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Edge removal liquid flow monitoring: float flowmeter |
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Flow range of edge removal liquid: 5-50ml/min |
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Backwash pipeline: 2 ways (4/6 inch each with 1 channel) |
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Backwash flow monitoring: float flowmeter |
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Backwash fluid flow range: 20-200ml/min |
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Chip fixation method: small area vacuum adsorption Chuck |
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Vacuum pressure alarm: digital vacuum pressure sensor |
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Chuck Material: PPS |
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Cup material: PP |
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Cup exhaust monitoring: digital pressure sensor |
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6 |
Developing unit |
Shutter:yes |
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Quantity: 2 sets (the following are configurations for each unit) |
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Spindle rotation speed: -5000rpm~5000rpm |
carrying idler |
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Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm) |
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Minimum adjustment of spindle rotation speed: 1rpm |
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Maximum acceleration of spindle rotation: 20000rpm/s |
carrying idler |
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Developing arm: 1 set |
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Developing pipeline: 2-way (fan-shaped/columnar nozzle) |
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Developer filtration: 0.2um |
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Developer temperature control: 23 ± 0.5 ℃ |
optional |
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Developing solution flow range: 100~1000ml/min |
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Motion mode of the developing arm: fixed point or scanning |
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Fusing arm: 1 set |
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Deionized water pipeline: 1 circuit |
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Deionized water nozzle diameter: 4mm (inner diameter) |
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Deionized water flow range: 100~1000ml/min |
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Nitrogen drying pipeline: 1 circuit |
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Nitrogen nozzle diameter: 4mm (inner diameter) |
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Nitrogen flow range: 5-50L/min |
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Developer, deionized water, nitrogen flow monitoring: float flowmeter |
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Backwash pipeline: 2 ways (4/6 inch each with 1 channel) |
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Backwash flow monitoring: float flowmeter |
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Backwash fluid flow range: 20-200ml/min |
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Chip fixation method: small area vacuum adsorption Chuck |
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Vacuum pressure alarm: digital vacuum pressure sensor |
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Chuck Material: PPS |
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Chuck Material: PPS |
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Cup material: PP |
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Cup exhaust monitoring: digital pressure sensor |
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7 |
Tackifying unit |
Quantity: 2 |
optional |
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Temperature range: room temperature~180 ℃ |
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Temperature uniformity: Room temperature~120 ℃± 0.75 ℃ 120.1℃~ 180℃ ± 1.5℃ (Remove 10mm from the edge, except for the ejector pin hole) |
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Minimum adjustment amount: 0.1 ° C |
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Temperature control method: PID adjustment |
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PIN height range: 0-20mm |
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PIN material: body SUS304, PIN pin cap PI |
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Baking gap: 0.2mm |
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Overtemperature alarm: positive and negative deviation alarm |
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Supply method: Bubbling, 10 ± 2ml/min |
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Chamber operation vacuum: -5-20KPa |
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8 |
Hot plate unit |
Quantity: 10 |
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Temperature range: room temperature~250 ℃ |
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Temperature uniformity: Room temperature~120 ℃± 0.75 ℃ 120.1℃~ 180℃ ± 1.5℃ 180.1℃~250℃ ±2.0℃ (Remove 10mm from the edge, except for the ejector pin hole) |
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Minimum adjustment amount: 0.1 ℃ |
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Temperature control method: PID adjustment |
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PIN height range: 0-20mm |
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PIN material: body SUS304, PIN pin cap PI |
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Baking gap: 0.2mm |
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Overtemperature alarm: positive and negative deviation alarm |
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9 |
Cold plate unit |
Quantity: 2 |
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Temperature range: 15-25 ℃ |
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Cooling method: constant temperature circulating pump cooling |
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10 |
Chemical Supply |
Photoresist storage: pneumatic glue pump * 4 sets (Optional tank or electric glue pump) |
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Glue dispensing volume: maximum 12ml per session, accuracy ± 0.2ml |
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Edge removal/back washing/RRC supply: 18L pressure tank * 2 (automatic replenishment) |
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Edge removal/back washing/RRC liquid level monitoring: photoelectric sensor |
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Photoresist liquid level monitoring: photoelectric sensor |
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Discharge of uniform adhesive waste liquid: 10L waste liquid tank |
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Developer supply: 18L pressure tank * 4 (Stored in the chemical cabinet outside the machine) |
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Deionized water supply: factory direct supply |
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Developing liquid level monitoring: photoelectric sensor |
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Developer waste discharge: factory waste discharge |
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Supply of tackifier: 10L pressure tank * 1, 2L pressure tank * 1 |
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Level monitoring of tackifier: photoelectric sensor |
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11 |
control system |
Control method: PLC |
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Human machine operation interface: 17 inch touch screen |
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Uninterruptible Power Supply (UPS): Yes |
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Set encryption permissions for device operators, technicians, administrators |
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Signal tower type: red, yellow, green 3 colors |
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12 |
System reliability indicators |
Uptime: ≥95% |
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MTBF: ≥ 500h |
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MTTR: ≤ 4h |
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MTBA： ≥24h |
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Fragmentation rate: ≤ 1/10000 |
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13 |
Other functions |
Yellow light: 4 sets (position: above the glue mixing and development unit) |
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THC: Yes, 22.5 ℃± 0.5 ℃, 45% ± 2% |
optional |
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FFU: Class 100, 5 sets (process unit and ROBOT area) |
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Guangzhou Minder-Hightech Co.,Ltd.
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