360i-8 inch Die bonder Technical specification | |
Solid Crystal Worktable (Linear Module) |
Optics System |
Worktable stroke100x300mm |
Camera |
Resolution1μm |
Optics Magnifier (wafer) 0.7 times to 4.5 times |
Die Workbench (Linear Module) |
Cycle Time200MS/EA |
XY stroke8"*8" |
Die bonding cycle is less than 250 milliseconds, |
Resolution1μm |
|
Wafer placement accuracy |
Loading and unloading module |
Adhesive die position x-y±2mil |
Use vacuum sucker to automatically feed |
Rotation accuracy±3° |
Use box cartridge receipt to unloading |
Pneumatic plate clamp, bracket width adjustment range of 25 ~ 90mm 25~90mm |
|
Dispensing module |
Equipment Require |
Swing arm dispensing + heating system |
VoltageAC220V/50HZ |
Dispensing needle set can be exchanged by single or multiple needle |
Air Source minimum 6BAR |
Vacuum Source700mmHG(Vacuum pump) |
|
PR System |
Dimensions And Weight |
Method256 grey levels |
Weight450kg |
Detectionink/chipping/cracked die |
Size(Dx Wx H)1200*900*1500mm |
Monitor17"LCD |
|
Monitor Resolution1024*768 |
Missing Die |
Vacuum Sensor |
|
Equipment Overview:
the equipment is customized according to your needs.
Name |
Application |
Mounting accuracy |
High-precision semiconductor Die Bonder |
High-precision optical modules, MEMS and other planar products |
±5 µm |
Fully automatic Eutectic Machine for optical devices |
TO9, TO56, TO38, etc |
±10 µm |
Flip Chip Die bonding machine |
Use flip-chip packaging products |
±30 µm |
Automatic TEC Die bonder |
TEC cooler particle patch |
±10 µm |
High-precision Die bonder |
PD, LD, VCSEL, Mic /Min TEC, etc |
±10 µm |
Semiconductor Die sorter |
Wafer, LED beads, etc |
±25 µm |
High-speed sorting and arranging machine |
Blue film chip sorting and filming |
±20 µm |
IGBT Chip Mounter |
Driver module, integration module |
±10 µm |
Online dual-head high-speed Die bonding machine |
Chip, capacitor, resistor, discrete chip and other surface-mount electronic components |
±25 µm |
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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