So how does your electronic devices work? Leads are small wires that connect itself with all parts of a device i.e. your phone, computer, TV. These wires are extremely thin, thin enough that you can hardly see them with your eyes! The technique is called wire bonding, the process by which ultra-small wires are attached to electronic equipment. This is an important step to ensure functionality and communication for all parts of its devices.
We have developed a very special machine, the Automatic Deep Access Ball Bonder, at a company called Minder-Hightech. This machine is special, wire bonding has never been easier and way faster than before. The most amazing thing about this machine is that It is so intelligent, it can bond wires itself without a single help of a person! This means without too much external help, it can work quickly and efficiently.
The wire bonding chip-making process was nothing short of tedious and time-consuming, that is, until we created the Automatic Deep Access Ball Bonder. They had to spend many hours bonding together tiny wires by hand, which not only was extremely slow but also tiring for them. Imagine sitting at a table, for hours on end, attempting to fit incredibly tiny pieces together! It could get frustrating.
But of course, now with this new machine the wire bonding process is going much smoother and faster. Now that doesn’t quite sound like the idea of “speed” … but it sure is interesting considering that the Automatic Deep Access Ball Bonder can bond wires faster than their little doll hands can move! This means that electronic components can be created and assembled in record time. The sooner we can bond wires, the sooner we can manufacture and sell new electronic devices to consumers.

It has special sensors on board that allow you to sense when a wire needs to be bonded. The machine place a wire across to attach that wire to the electronic device. Bonding wires with accuracy up to 99% is possible with the Automatic Deep Access Ball Bonder. In other words, nearly every single bond it forms is the right one, and that is a critical step in ensuring that an electronic device will function correctly.

And this machine has made it safer for workers to operate them, too. Previously, workers had to manually pick up tiny wires, which proved dangerous and tiring. Workers can’t do that anymore with the Automatic Deep Access Ball Bonder. This way you will have can just trust the machine to do the job for you and that will also make people safe, and get the work done quickly.

Our customers harness the power of the Automated Deep Access Ball Bonder technology to manufacture electronic devices at speeds never seen before. This allows them to bring their products to market much sooner than their competition. This technology is user-friendly, allowing our customers to save time and money. The chip can already do a good job at that, so they don't need to hire additional man-power for wire bonding.
automatic deep access ball bonder represents the semiconductor and electronic products sector in service and sales. We have more than 16 years of experience selling equipment. We're committed to providing customers Superior, Reliable and One-Stop Solutions for machinery equipment.
Minder-Hightech automatic deep access ball bonder become a well-known brand in industrial world, based on the years of machine solution experience and good relationship with oversea customers from Minder-Hightech. We created "Minder-Pack" which focuses on the manufacturing of packages solution, as well as other high value machines.
Minder Hightech is comprised by a group of highly educated experts, highly skilled engineers and automatic deep access ball bonder, with impressive professional skills and expertise. Since its inception, our products have been introduced to many industrialized countries around the world and have helped customers increase efficiency, cut costs and enhance the quality of their products.
We offer a automatic deep access ball bonder range of products, including wire bonder and die bonder.
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