Wafer Expander / Die Matrix Expander /Wafer Film Expanding Machine
Applicable to IC, diode, transistor, glass, led, QFN, PCB and other industries, and is applicable to the expansion or stretching process after the cutting process in the semiconductor integrated circuit chip manufacturing.













Machine parameter description |
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Model: |
DSX-25-071 |
Mounting method. |
Fixed pressure plate |
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Positioning Method: |
None |
Heating system: |
Heating plate (0-120°C) |
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Air Pressure: |
0.6-0.8Mpa |
Total power: |
500W |
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Machine Voltage: |
AC220V |
Operating mode: |
Semi-automatic |
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Rated voltage |
AC 220V |
Frequency |
50/60HZ |
Power |
<400W |
Pressure |
0.5~0.6Mpa |
Machine weight |
50kg |
Film type |
UV / PVC material film / blue film |
Film thickness |
0.05~0.2mm |
Table heating temperature |
0-80℃ |
Membrane expanding function |
Semi-automatic |
Film cutting function |
Automatic film cutting |
Process |
After Semiconductor/Led Wafer Dicing |


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