Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine
  • RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine

RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine

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Product Description

RYW-ETB05B Submicron Semi-Automatic Eutectic Bonding Machine

Offering alignment accuracy of ±0.5μm, it is suitable for various precision positioning, chip mounting, and high-end packaging processes, including flip-chip bonding, ultrasonic gold ball bonding, laser bonding, gold-tin eutectic bonding, and dispensing bonding. The equipment offers high cost-effectiveness, a modular design, and flexible configuration, suitable for various flip-chip, upright chip, and Micro LED applications, covering almost all micro-assembly and placement processes. It is primarily designed for small-batch production and to meet the needs of prototyping, research and development, and university teaching and research.

Process:

Thermo-compressing
Thermo-ultrasonic bonding (optional)
Ultrasonic bonding (optional)
Reflow bonding (optional)
Dispensing (optional)
Mechanical assembly
UV curing (optional)
Eutectic bonding

Application:

Laser diode bonding
VCSEL, PD, and lens assembly packaging
High-end LED packaging
Micro-optical device packaging
MEMS/MOEM packaging
Sensor packaging
3D packaging
Wafer-level packaging (C2W)
Flip chip bonding (face down)
Bonding Assembly Process
Pressure and Temperature Real-time Curve:
Sample Case:
Equipment real shoots
Specification
Model
RYW-ETB05B
RYW-ETB20
RYW-ETB05S
RYW-ETB05
Alignment Accuracy
±0.5μm
±2μm
±0.5μm
±2μm
Field of View
0.5×0.3-5.4×4mm²
1.2×0.9-14.4×10.8mm²
0.5×0.3-5.4×4mm²
1.2×0.9-14.4×10.8mm²
Substrate Size
150mm/6-inch（300mm/12-inch）
Chip Size
0.1~40mm
Axis Fine Adjustment
±10°
Fine Adjustment Range
2.5×2.5×10mm Res(0.5μm)
Pressure Range
0.2~30N(Option 100N)
Heating Temperature
350±1℃ (Option 450℃)
Heating and Cooling Rates
Heat: 1~100℃/s; Cool: >5℃/s
Operating Range
100mm×200mm
Device Dimensions
L0.7×W0.6×H0.5m
Operation Type
Semi-Automatic Rotary
Manual Rotary
Device Weight
120Kg
100Kg
Packing & Delivery
Company Profile
Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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