Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging resins.

Equipment specifications |
MD-SG250 |
MD-SG300 |
MD-SG350 |
Carrier specifications |
φ250mm |
φ300mm |
φ350mm |
Processing thickness |
≤50mm |
≤50mm |
≤50mm |
Equipment power supply |
380V |
380V |
380V |
Equipment size |
850x1400x2000mm |
850x1400x2000mm |
850x1400x2000mm |
Equipment weight |
1800 KG |
1800 KG |
2000 KG |


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