1. Small desktop single workstation model, used for high-precision grinding and polishing of wafers and samples. 2. The grinding and polishing disc has a diameter of 400mm and can be used for processing wafers and samples of six inches or less.
Feature
1. Maximum wafer size for grinding and polishing is 6 inches. 2. Swing arm swing amplitude is adjustable from 0 to 15 degrees. 3. Swing arm swing speed is uniformly adjustable. 4. Drip rate is uniformly adjustable from 1 to 100 ml/min. 5. Full LCD screen control. 6. Plate speed is 5-100 rpm.
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment.
Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price: All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample: We can provide sample production services for you, but you may provide some fees.
3. About Payment： After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery: After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging: After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty: Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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