Guangzhou Minder-Hightech Co.,Ltd.

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  • Semiconductor Wafer Cleaving Machine
  • Semiconductor Wafer Cleaving Machine

Semiconductor Wafer Cleaving Machine

Product Description

Wafer Cleaving Machine

Suitable for specialized equipment for cutting and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. with a diameter of less than 4 inches. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.
Feature
Low COO, Robust Platform
High Precision Positioning
Vibration Free Stage Design
Automatic Processing
Advanced Software Functions
Accommodates Multiple Break/Process Modules
Specification
Cutting head
X direction
Travel range: 120mm
Roller pressure
0~100gf
Positioning accuracy: 5 μ m
Knife pressure
0~20gf
Y direction
Travel range: 100mm
Equipment weight
About 60kg
Positioning accuracy: ±5 μ m
Lens Y direction
Travel range:650*650*400mm
T direction
360 degree rotation
External dimensions
1170mmx730 mmx500mm
Wafer size
Suitable for 4-inch (100mm) wafers
Operation interface
19.5 "TFT color screen, Chinese interface
Image system
6.0X magnification (4.0X optional)
Control system
Windows 7 operating system, dedicated control software for cleavage machines
Standard configuration
Host \ Computer \ 19.5 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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