Cutting head |
X direction |
Travel range: 120mm |
Roller pressure |
0~100gf |
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Positioning accuracy: 5 μ m |
Knife pressure |
0~20gf |
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Y direction |
Travel range: 100mm |
Equipment weight |
About 60kg |
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Positioning accuracy: ±5 μ m |
Lens Y direction |
Travel range:650*650*400mm |
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T direction |
360 degree rotation |
External dimensions |
1170mmx730 mmx500mm |
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Wafer size |
Suitable for 4-inch (100mm) wafers |
Operation interface |
19.5 "TFT color screen, Chinese interface |
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Image system |
6.0X magnification (4.0X optional) |
Control system |
Windows 7 operating system, dedicated control software for cleavage machines |
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Standard configuration |
Host \ Computer \ 19.5 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard |
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