Guangzhou Minder-Hightech Co.,Ltd.

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Home> Laboratory Semiconductor Equipment
  • Semiconductor Lab machine Cylinder Polishing Machine
  • Semiconductor Lab machine Cylinder Polishing Machine

Semiconductor Lab machine Cylinder Polishing Machine

Product Description
Cylinder Polishing Machine
Feature
1. Maximum cylinder diameter for curved surface polishing is 100mm
2. Maximum inner hole diameter for curved surface polishing is 20mm
3. Dual peristaltic pump feeding
4. Disc speed is adjustable from 5 to 100rpm
5. Drip rate is evenly adjustable from 1 to 100ml/min
6. Full LCD screen control
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you
with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will
only charge the cost price.

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