Semi Automatic Wafer Grinder , China Semi Automatic Wafer Grinder Manufacturers, Suppliers, Factory

Product Description

Semi automatic wafer grinder

□ Semi automatic single axis wafer back thinning
□ Grindable wafer size 4-8 "， 6、8、12”
□ Single axis single disc mode
□ Online thickness measurement
□ Corresponding to irregular specifications

Capable of processing irregular shaped product

Packing & Delivery

Specification

Grindable wafer	Size	Inches	4,5,6,8
Rubbing way		-	Vertical plunge grinding method
Grinding wheel spindle	Types	-	Air bearings
		Quantity	-	1
		Speed	rpm	0~5000
		Output Power	Kw	5.5/7.5
		Stroke	mm	150
		Feed Speed	um/s	0.01~100
		Fast forward speed	mm/min	300
		Resolution	um	0.1
Workpiece axis	Type	-	Ball bearings
		Quantity	-	1
		Speed	rpm	0~300
		Power	kw	0.75
		Suction cup type	-	Microporous ceramics
		Wafer suction method	-	Vacuum adsorption
Wafer transfer		-	Manual
Other functions	Wafer centering	-	-
		Wafer cleaning	-	-
		Suction cup cleaning	-	-
Grinding wheel		mm	Φ200
Online measurement	Measurement range	um	0~1800
		Resolution	um	0.1
		Repeat accuracy	um	±0.5
Machining accuracy	Intra-wafer accuracy (TTV)	um	≤2
		Inter-wafer accuracy (WTW)	um	±3
		Surface roughness (Ry)	um	0.1(2000#finish)
Appearance	Appearance coloring	um	Orange Pattern
		Dimensions(W×D×H)	mm	690×1720×1780
		Weight	kg	1400

Grindable wafer	Size	Inches	6,8,12
Rubbing way		-	Vertical plunge grinding method
Grinding wheel spindle	Types	-	Air bearings
		Quantity	-	1
		Speed	rpm	0~5000
		Output Power	Kw	5.5/7.5
		Stroke	mm	150
		Feed Speed	um/s	0.01~100
		Fast forward speed	mm/min	300
		Resolution	um	0.1
Workpiece axis	Type	-	Ball bearings
		Quantity	-	1
		Speed	rpm	0~300
		Suction cup type	-	Microporous ceramics
		Wafer suction method	-	Vacuum adsorption
Wafer transfer		-	Manual
Other functions	Wafer centering	-	-
		Wafer cleaning	-	-
		Suction cup cleaning	-	-
Grinding wheel		mm	Φ300
Online measurement	Measurement range	um	0~1800
		Resolution	um	0.1
		Repeat accuracy	um	±0.5
Machining accuracy	Intra-wafer accuracy (TTV)	um	≤3
		Inter-wafer accuracy (WTW)	um	±3
		Surface roughness (Ry)	um	0.13(2000#finish)
Appearance	Appearance coloring	um	Orange Pattern
		Dimensions(W×D×H)	mm	790×2170×1830
		Weight	kg	1800

Company Profile

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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