Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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Home> Wire Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder
  • MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder

MDZWSQB-1522 Deep Access Automatic Wire Ball Bonder

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Product Description
Primarily used in industries such as integrated circuit packaging, optical communication, microwave, and laser.
Micro assembly, System in Package (SIP), Multi chip, complex packaging solution

Product Overview:

1. Targeted solutions for complex packaging of micro-assembled multi-chip and multi-substrate materials.
2. Graphical & global real-time & unit real-time visualization, guided programming, and efficient user product import.
3. Directory-based collaboration, material-based regional referencing, and ultra-fast wire bonding process programming.
4. Material-based regional referencing & database-driven process parameter interaction, ensuring high adaptability for
multi-chip processes.
5. Efficient algorithm integration, including Looping, Bonding, and Tearing, for condensed process parameters.
6. Integrated active Tail mode, effectively adapting to bonding tail wire control for multiple material types.
7. Compatible and easy-to-operate mounting system equipment platform.
8. High adaptability for multiple product types, rapid product switching, convenient capacity matching, and extreme process requirements.

Product Features:

1. Optical imaging system including RGB, adaptable to various materials such as IC, FR4, HTCC, and LTCC.
2. High-speed direct-drive common platform technology for stability, accuracy, and speed.
3. Process-level comprehensive positioning accuracy: ±3um@3σ
4. Graphical, global real-time, and unit-level real-time views for guided programming and execution control.
5. Efficient algorithms for fixed-length/fixed-height looping, bonding, and tearing; process parameter optimization
specifically for SIP processes.
6. Integrated active tail control, effectively adapting to multi-material wire bonding tail control.
7. Self-developed high-speed, high-precision, low-vibration platform for low maintenance and guaranteed accuracy.
8. Visual-based rapid BTO calibration, reducing process dependency.
9. Fast and flexible WCL system for precise and high responsiveness.
10. Efficient thermal system design for low disturbance at high temperatures.
11. Directory-based and area-referenced, ultra-fast wire bonding process programming.
12. Area-referenced database mode for process parameter interaction.
13. Composite process execution mode, adaptable to ultra-large-scale SIP packaging.
14. Ball bonding, double ball bonding, BSOB, BBOS, fixed-length/fixed-height looping, SIP matching process system.
15. Monitoring, trajectory, and control-based QC monitoring modes.
16. High-efficiency WP and WT systems, high integration and high performance.
17. System-level and personalized programs, subroutines, and parameter libraries.
18. Direct Auto Pad Focus assist system.
Sample
Specification
Bonding Area
200mm*250mm (Adjustable worktable)
200mm*150mm (In-line track, non-standard customized);
Z-axis travel: 50mm, θ-axis travel: ±90°
Bonding Tool Length
16/19 mm
Bonding Pressure
5~300g Low Impact
(Absolute accuracy ±1g @ "10g~100g" or 1% @ 100g~300g, repeatability ±0.5g)
Main Camera Field of View
4.2mm*3.5mm or 8.4mm*7.0mm
Interface Standard
SECS/GEM communication protocol, SMEMA connection standard
Overall Process Positioning Accuracy
±3um@3σ (±2um@3σ single item evaluation)
Cavity Depth (Whole Area)
10 mm
Ultrasonic
4W/100KHz (High precision)
Auxiliary Camera Field of View (including E_BOX function)
4.2mm*3.5mm or 8.4mm*7.0mm
Equipment Dimensions
1110mm*1350mm*1900mm (Width*Depth*Height) (Adjustable worktable) 1400mm*1350mm*1900mm (Width*Depth*Height) (In-line track)
Gold Wire Diameter
12-50 μm (Silver wire, copper wire non-standard customized, wire diameter range single item evaluation)
Electronic Ignition
Multiple Profile real-time control (maximum adaptation to gold wire diameter 75um)
UPH
1~4 Wire/S, wire diameter & process & wire arc related
Material System
Standard adjustable worktable, customizable in-line track
Power Supply
AC 220V ±10% - 10A @ 50Hz
Weight
1000 kg
Compressed Air
≥10LPM @ 0.5MPa, purified air source
Vacuum Source
≥50LPM @ -85kPa
Packing & Delivery
Company Profile
Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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