




Bonding Stroke |
15mm*15mm*18mm |
Wire Diameter (Gold/Aluminum Wire) |
18-100μm (Copper wire, ultra-fine wire diameter range requires separate evaluation) |
Spool Size |
1/2 inch, 2 inches |
Bonding Tool Length |
25mm (19mm optional with custom Wire Clamp) |
Cavity Depth (Whole Area) |
15mm (10mm, with 19mm bonding tool) |
Bonding Pressure |
5~150g Low Impact (Absolute accuracy ±1g @ “10g~100g” or 1% @ 100g~150g, repeatability ±0.5g) |
Ultrasonic |
4W/100KHz (High precision) |
Handle Gear Ratio |
8:1 (Standard value) |
Operating Menu |
8″ TFT Touch Screen |
Lifting Platform Size |
250mm*250mm*18mm |
Device Size |
200mm*200mm and above |
Equipment Dimensions |
750mm*580mm*500mm |
Power Supply |
AC 220V±10%-5A@50Hz |
Compressed Air |
|
Weight |
70kg |



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