Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder
  • MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder

MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder

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Product Description

MDZW-BB1850 Manual and Semi-Automatic Wire Ball Bonder

1. Possesses the complete functionality of a standalone manual wire bonding machine.
2. Features independent motion control technology, offering greater control and adjustability based on operator preferences.
3. Incorporates automatic machine technology, enhancing the level of automation and further minimizing the impact of manual operation.
4. Automatic functions include: automatic wire placement, automatic wire looping, automatic welding, automatic BSOB & BBOS & BALL bonding, and automatic wire length setting.
5. Instantaneous manual/automatic switching allows for a dual-mode combination, increasing process coverage for specialized products.
6. Process parameters and bonding heads are compatible with automatic machines, facilitating easier integration into industrial production processes.
Sample Real Shoots:

Product Features:

1. Complete manual wire bonding machine functionality
2. High process coverage with instant manual/automatic switching
3. Efficient algorithms for fixed-length/fixed-height looping, bonding tearing, and targeted process parameter optimization for SIP processes
4. Separate motion control technology, configurable manual control, manual triggering & automatic welding, eliminating the impact of manual operation
5. Automatic machine force control technology for stable, accurate, and flexible pressure
6. Monitoring and control-based QC control mode
7. Motion platform repeatability accuracy of ±1um, configurable control ratio accuracy
8. Manual alignment, automatic welding
Welding > Automatic arc formation > Automatic welding > Automatic tail wire > Automatic ball formation > Automatic ball pressing (or ball placement)
9. Fast and flexible WCL system, precise and highly responsive
10. Automatic tail wire retention and automatic ignition upon welding completion, reducing manual handling
11. Automatic wire routing, automatic wire arc, automatic welding, automatic BSOB & BBOS & BALL, automatic wire length setting
12. Automatic machine technology transfer, facilitating easier product integration in the industrialization process
Specification
Bonding Stroke
15mm*15mm*18mm
Gold Wire Diameter
12-50μm (Silver and copper wires are non-standard and require custom orders; wire diameters outside this range require individual
evaluation)
Spool Size
1/2 inch, 2 inches
Bonding Tool Length
16/19mm
Cavity Depth (Whole Area)
10mm
Electronic Ignition
Multi-Profile Real-time Control (Maximum adaptation to gold wire diameter of 75um)
Bonding Pressure
5~150g Low Impact
(Absolute accuracy ±1g @ "10g~100g" or 1% @ 100g~150g, repeatability ±0.5g)
Ultrasonic
4W/100KHz (High precision)
Handle Gear Ratio
8:1 (Standard value)
Operating Menu
8″ TFT Touch Screen
Lift Table Dimensions
250mm*250mm*18mm
Device Size
200mm*200mm and above
Equipment Dimensions
750mm*580mm*500mm
Power Supply
AC 220V±10%-5A@50Hz
Compressed Air
≥[email protected]
Weight
70kg
Packing & Delivery
Company Profile
Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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