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  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type
  • MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type

MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type

Product Description

MDVES-3545-3 6 Offline Multi-layer Vacuum Soldering Furnace Mass Production Type

Welding area 350 * 450MM * 3 layers
Welding area 350 * 450MM * 6 layers
Single and double warehouses can work independently
Ultimate vacuum degree 10Pa
Heating rate 40 ° C/min, cooling rate 60 ° C/min
Lateral temperature difference ± 3 ℃
Formic acid+nitrogen, reducing protective gas
Siemens PLC control system
Welding process plan for on-board IGBT power module
Process plan for multi-layer vacuum welding furnace - overall process time of 30min/furnace
SAC305 technological process:
Preheating section preheating, formic acid reduction
1. Vacuum to a set vacuum level below 1mbar
2. Fill with nitrogen gas and set the flow rate to 60-100L/min to 950mbar
3. Heat up to 200 ℃
4. Maintain the temperature for 30 seconds while vacuuming to 1 mbar
5. Fill with formic acid, set the flow rate to 30L/min, and charge to 850mbar
6. Maintain 150S in a formic acid environment at 200 ℃ Welding section vacuum extraction and bubble discharge
7. Heat up to welding temperature of 260 ℃
8. After reaching the target temperature, maintain for 30 seconds
9. Vacuum to 1mbar, maintain for 60s after reaching the vacuum level
10. Charge nitrogen to 1000mbar at atmospheric pressure cooling
11. Set target temperature of 45 ℃ and cooling water temperature of 23 ℃
12. End after reaching the target temperature
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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