MDND-ADB700 High-speed High precision Stacked Chips Advanced Die Bonder , China MDND-ADB700 High-speed High precision Stacked Chips Advanced Die Bonder Manufacturers, Suppliers, Factory

Product Description

MDND-ADB700 High-speed High precision Stacked Chips Advanced Die Bonder

High-speed stacking chip die bonder is mainly used for memory chip stacking and die bonding. It is compatible with single and double head production and fully automatic placement.
The high-speed motion axis and vibration suppression design achieve a maximum efficiency of 6000 CPH, and over 2400 CPH with a 1-second bonding process.
This system achieves high-precision die bonding with a global accuracy of ±7µm and can stack up to 32 layers of chips, meeting the demands of high-precision, high-speed thin-die bonding.

Accuracy: ±7um@3σ

Specification

Equipment Capability Comparison:

MDND-ADB700 Advanced Die Bonder	Other
CPH:2400(1s)	CPH：<2200(1s)
Accuracy:±7um@3σ	Accuracy: ±10µm or less
Supports automatic waffle tray changer	Not supported
Supports dual dispensing heads	Not supported/single-point glue
Chip thickness: >25µm	Chip thickness: >50µm
Flip Chip	not support flip chip

Parameters:

X/Y placement accuracy	±7µm @ 3σ (calibration film)
Rotation accuracy	±0.07° @ 3σ (calibration film)
Bond head rotation angle	0-360°
CPH	2400 (1s)
Supported chip size	0.25-25mm
Maximum supported substrate size	300*110mm
Bond force	50-5000gf
Flip-chip module	Optional
Single/Dual dispensing head	Optional
Automatic/manual tray loading	Optional
Supported Substrate Types	Lead-frame, Strips, Carrier
Supported Chip Types	Wafer Ring, Waffle Pack, Wafer Expansion Ring, Tray
Device Dimensions	261015002010mm (including loaders and unloaders)
Operating Air Pressure	0.4-0.6MPa
Device Weight	2300kg
Power Supply	220V 50/60Hz/2.5kVA
Operating Environment	20±3°C/40%-60% RH

Product Details

High Precision:

±7um @3σ Placement Accuracy
±0.07° @3σ Rotation Accuracy
Lamination Range: 300 x 100mm
UPH: 2400 (1s)

Supports flip-chip processing:

Ultra-thin chip pickup:

Mechanism compatible with both PVRMS and PVMS

Supports single-head and dual-head mode switching

Supports dual dispensing heads:

Fully automatic loading:

Supports automatic waffle tray replacement
Supports automatic wafer tray replacement

Equipment Real Shoots

Packing & Delivery

Company Profile

Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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MDND-ADB700 High-speed High precision Stacked Chips Advanced Die Bonder