|
project
|
Specifications
|
remarks
|
||
|
1 |
Equipment Overview |
Equipment name: Fully auto uniform glue developing machine
|
||
|
Equipment model: MD-2C2D6
|
||||
|
Processing wafer specifications: compatible with 4/6-inch standard wafers
|
||||
|
Process flow of uniform glue: Flower basket slicing → centering → uniform glue (dripping → uniform glue → edge removal, back
washing) → hot plate → cold plate → basket placing Development process flow: Flower basket slicing → centering → development (development solution → deionized water, back washing → nitrogen drying) → hot plate → cold plate → basket placing |
||||
|
Overall size (approximately): 2100mm (W) * 1800mm (D) * 2100mm (H)
|
||||
|
Chemical cabinet size (approximately): 1700(W) * 800(D) * 1600mm (H)
|
||||
|
Total weight (approximately):1000kg
|
||||
|
Workbench height: 1020 ± 50mm
|
||||
|
2 |
Cassette unit
|
Quantity: 2
|
||
|
Compatible size: 4/6 inches
|
||||
|
Cassette detection: microswitch detection
|
||||
|
Slide out detection: Yes, reflective sensor
|
||||
|
3 |
robot |
Quantity: 1
|
||
|
Type: Double arm vacuum adsorption robot
|
||||
|
Degree of freedom: 4-axis (R1, R2, Z, T)
|
||||
|
Finger material: ceramic
|
||||
|
Substrate fixation method: vacuum adsorption method
|
||||
|
Mapping function: Yes
|
||||
|
Positioning accuracy: ± 0.1mm
|
||||
|
4 |
Centering unit
|
Quantity: 1 set
|
Optional optical alignment
|
|
|
Alignment method: mechanical alignment
|
||||
|
Centering accuracy: ± 0.2mm
|
||||
|
5 |
Uniform glue unit |
Quantity: 2 sets (the following are configurations for each unit)
|
||
|
Spindle rotation speed: -5000rpm~5000rpm
|
carrying idler
|
|||
|
Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm)
|
||||
|
Minimum adjustment of spindle rotation speed: 1rpm
|
||||
|
Maximum acceleration of spindle rotation: 20000rpm/s
|
carrying idler
|
|||
|
Dripping arm: 1 set
|
||||
|
Photoresist tube route: 2 routes
|
||||
|
Photoresist nozzle diameter: 2.5mm
|
||||
|
Photoresist insulation: 23 ± 0.5 ℃
|
optional
|
|||
|
Moisturizing nozzle: Yes
|
||||
|
RRC: Yes
|
||||
|
Buffer: Yes, 200ml
|
||||
|
Glue dropping method: center dropping and scanning dropping are optional
|
||||
|
Edge removal arm: 1 set
|
||||
|
Edge removal nozzle diameter: 0.2mm
|
||||
|
Edge removal liquid flow monitoring: float flowmeter
|
||||
|
Flow range of edge removal liquid: 5-50ml/min
|
||||
|
Backwash pipeline: 2 ways (4/6 inch each with 1 channel)
|
||||
|
Backwash flow monitoring: float flowmeter
|
||||
|
Backwash fluid flow range: 20-200ml/min
|
||||
|
Chip fixation method: small area vacuum adsorption Chuck
|
||||
|
Vacuum pressure alarm: digital vacuum pressure sensor
|
||||
|
Chuck Material: PPS
|
||||
|
Cup material: PP
|
||||
|
Cup exhaust monitoring: digital pressure sensor
|
||||
|
6 |
Developing unit |
Shutter:yes
|
||
|
Quantity: 2 sets (the following are configurations for each unit)
|
||||
|
Spindle rotation speed: -5000rpm~5000rpm
|
carrying idler
|
|||
|
Spindle rotation accuracy: ± 1rpm (50rpm~5000rpm)
|
||||
|
Minimum adjustment of spindle rotation speed: 1rpm
|
||||
|
Maximum acceleration of spindle rotation: 20000rpm/s
|
carrying idler
|
|||
|
Developing arm: 1 set
|
||||
|
Developing pipeline: 2-way (fan-shaped/columnar nozzle)
|
||||
|
Developer filtration: 0.2um
|
||||
|
Developer temperature control: 23 ± 0.5 ℃
|
optional
|
|||
|
Developing solution flow range: 100~1000ml/min
|
||||
|
Motion mode of the developing arm: fixed point or scanning
|
||||
|
Fusing arm: 1 set
|
||||
|
Deionized water pipeline: 1 circuit
|
||||
|
Deionized water nozzle diameter: 4mm (inner diameter)
|
||||
|
Deionized water flow range: 100~1000ml/min
|
||||
|
Nitrogen drying pipeline: 1 circuit
|
||||
|
Nitrogen nozzle diameter: 4mm (inner diameter)
|
||||
|
Nitrogen flow range: 5-50L/min
|
||||
|
Developer, deionized water, nitrogen flow monitoring: float flowmeter
|
||||
|
Backwash pipeline: 2 ways (4/6 inch each with 1 channel)
|
||||
|
Backwash flow monitoring: float flowmeter
|
||||
|
Backwash fluid flow range: 20-200ml/min
|
||||
|
Chip fixation method: small area vacuum adsorption Chuck
|
||||
|
Vacuum pressure alarm: digital vacuum pressure sensor
|
||||
|
Chuck Material: PPS
|
||||
|
Chuck Material: PPS
|
||||
|
Cup material: PP
|
||||
|
Cup exhaust monitoring: digital pressure sensor
|
||||
|
7 |
Tackifying unit |
Quantity: 2
|
optional
|
|
|
Temperature range: room temperature~180 ℃
|
||||
|
Temperature uniformity: Room temperature~120 ℃± 0.75 ℃
120.1℃~ 180℃ ± 1.5℃ (Remove 10mm from the edge, except for the ejector pin hole) |
||||
|
Minimum adjustment amount: 0.1 ° C
|
||||
|
Temperature control method: PID adjustment
|
||||
|
PIN height range: 0-20mm
|
||||
|
PIN material: body SUS304, PIN pin cap PI
|
||||
|
Baking gap: 0.2mm
|
||||
|
Overtemperature alarm: positive and negative deviation alarm
|
||||
|
Supply method: Bubbling, 10 ± 2ml/min
|
||||
|
Chamber operation vacuum: -5-20KPa
|
||||
|
8 |
Hot plate unit |
Quantity: 10
|
||
|
Temperature range: room temperature~250 ℃
|
||||
|
Temperature uniformity: Room temperature~120 ℃± 0.75 ℃
120.1℃~ 180℃ ± 1.5℃ 180.1℃~250℃ ±2.0℃ (Remove 10mm from the edge, except for the ejector pin hole) |
||||
|
Minimum adjustment amount: 0.1 ℃
|
||||
|
Temperature control method: PID adjustment
|
||||
|
PIN height range: 0-20mm
|
||||
|
PIN material: body SUS304, PIN pin cap PI
|
||||
|
Baking gap: 0.2mm
|
||||
|
Overtemperature alarm: positive and negative deviation alarm
|
||||
|
9 |
Cold plate unit
|
Quantity: 2
|
||
|
Temperature range: 15-25 ℃
|
||||
|
Cooling method: constant temperature circulating pump cooling
|
||||
|
10 |
Chemical Supply |
Photoresist storage: pneumatic glue pump * 4 sets (Optional tank or electric glue pump)
|
||
|
Glue dispensing volume: maximum 12ml per session, accuracy ± 0.2ml
|
||||
|
Edge removal/back washing/RRC supply: 18L pressure tank * 2 (automatic replenishment)
|
||||
|
Edge removal/back washing/RRC liquid level monitoring: photoelectric sensor
|
||||
|
Photoresist liquid level monitoring: photoelectric sensor
|
||||
|
Discharge of uniform adhesive waste liquid: 10L waste liquid tank
|
||||
|
Developer supply: 18L pressure tank * 4 (Stored in the chemical cabinet outside the machine)
|
||||
|
Deionized water supply: factory direct supply
|
||||
|
Developing liquid level monitoring: photoelectric sensor
|
||||
|
Developer waste discharge: factory waste discharge
|
||||
|
Supply of tackifier: 10L pressure tank * 1, 2L pressure tank * 1
|
||||
|
Level monitoring of tackifier: photoelectric sensor
|
||||
|
11 |
control system |
Control method: PLC
|
||
|
Human machine operation interface: 17 inch touch screen
|
||||
|
Uninterruptible Power Supply (UPS): Yes
|
||||
|
Set encryption permissions for device operators, technicians, administrators
|
||||
|
Signal tower type: red, yellow, green 3 colors
|
||||
|
12 |
System reliability indicators
|
Uptime: ≥95%
|
||
|
MTBF: ≥ 500h
|
||||
|
MTTR: ≤ 4h
|
||||
|
MTBA： ≥24h
|
||||
|
Fragmentation rate: ≤ 1/10000
|
||||
|
13 |
Other functions
|
Yellow light: 4 sets (position: above the glue mixing and development unit)
|
||
|
THC: Yes, 22.5 ℃± 0.5 ℃, 45% ± 2%
|
optional
|
|||
|
FFU: Class 100, 5 sets (process unit and ROBOT area)
|
||||
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
EN
AR
BG
CS
DA
NL
FI
FR
DE
EL
IT
KO
NO
PL
PT
RO
RU
ES
SV
TL
IW
ID
LT
SR
SL
UK
VI
ET
HU
TH
TR
FA
AF
MS
GA
IS
HY
AZ
KA
