Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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Home> Micro-electronics Laboratory Machines
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder
  • Manual Epoxy and Eutectic Die Bonder

Manual Epoxy and Eutectic Die Bonder

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Product Description

Manual Epoxy and Eutectic Die Bonder

1. Effective solution without touching the surface of the chip Clamp edge collapse problem
2. Automatic scribing, dispensing, sticking, automatic rebound height detection
3. The chip friction range is adjustable, the solder overflows evenly, and the void rate is small.
Specification
Screen:
Industrial computer touch screen
Chinese and English interface
SMD method:
Vacuum adsorption, clip clamping,
Eutectic Chip Size:
≤8mm
Bonded Chip Size:
0.2-25mm
Minimum component size:
150*150μm
Friction direction:
X&Y bidirectional
Friction Amplitude:
20-500um
Adhesive pressure:
10-150g
Chip suction nozzle:
360°rotatable
Fine mobile X&Y&Z platform:
50*50*50，Resolution 0.2μm
vacuum tool holder , With nitrogen protection (optional pulse heating system)

Compatibility

*Adapt to multi-sized chips without custom nozzles
*Adapt to all kinds of solder epoxy patch & eutectic patch

Safety

*Accurate positioning with automatic height detection
*Program-controlled clip opening and closing does not damage the chip
*Clamping force is stable

Stability

*Servo motor drive for smooth operation
*The integrated electronic control system has a low failure rate
*Industrial Panel PC

Adaptability

Optional pulse heating method, fast heating and cooling speed
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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