
|  Grindable wafer |  Size |  Inches |  4,5,6,8 | 
|  Wafer cassette |  Number |  - |  2 | 
|  Rubbing way |  - |  Vertical plunge grinding method | |
|  Grinding wheel spindle |  Types |  - |  Air bearings | 
|  Quantity |  - |  2 | |
|  Speed |  rpm |  0~5000 | |
|  Output Power |  Kw |  5.5/7.5 | |
|  Stroke |  mm |  150 | |
|  Feed Speed |  um/s |  0.01~100 | |
|  Fast forward speed |  mm/min |  300 | |
|  Resolution |  um |  0.1 | |
|  Workpiece axis |  Type |  - |  Ball bearings | 
|  Quantity |  - |  3 | |
|  Suction cup type |  - |  Microporous ceramics | |
|  Wafer suction method |  - |  Vacuum adsorption | |
|  Speed |  rpm |  0~300 | |
|  Wafer transfer |  - |  Robot arm | |
|  - |  Revolving disk | ||
|  Other functions |  Wafer centering |  - |  Mobile pin alignment | 
|  Wafer cleaning |  - |  Water and air cleaning,spin drying | |
|  Suction cup cleaning |  - |  Oilstone cleaning | |
|  Grinding wheel |  mm |  Φ200 | |
|  Online  measurement |  Measurement range |  um |  0~1800 | 
|  Resolution |  um |  0.1 | |
|  Repeat accuracy |  um |  ±0.5 | |
|  Machining  accuracy |  Intra-wafer accuracy (TTV) |  um |  ≤2 | 
|  Inter-wafer accuracy (WTW) |  um |  ±3 | |
|  Surface roughness (Ry) |  um |  0.13(2000#finish) | |
|  Appearance |  Appearance coloring |  um |  Orange Pattern | 
|  Dimensions(W×D×H) |  mm |  1200×2750×1950 | |
|  Weight |  kg |  4200 | 










Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved