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Home> Wafer Grinder
  • Precision CMP System
  • Precision CMP System
  • Precision CMP System
  • Precision CMP System
  • Precision CMP System
  • Precision CMP System

Precision CMP System

Model: MDAM-CMP100 / MDAM-CMP150

Precision CMP system is mainly used for lapping and thinning of main semiconductor chips such as silicon, silicon dioxide and indium antimonide focal plane chips, and chemical mechanical polishing of

bottom, surface and end face.

MDAM-CMP100  /MDAM-CMP150

Precision CMP System

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Equipment Overview:

Precision CMP system is mainly used for lapping and thinning of main semiconductor chips such as silicon, silicon dioxide and indium antimonide focal plane chips, and chemical mechanical polishing of bottom, surface and end face.

The whole machine and all parts of the equipment are fully anticorrosive, and the process parameters be set through the touch screen interactive interface.

Processable sample size:

Sample size ≤152mm/6 inch

Machinable thickness is 50μm ~ 10 mm

Achievable process indicators:

1.The total thickness deviation (TTV) of φ75mm wafer is within 2 μm;

2.The total thickness deviation (TTV) of φ100mm wafer is within 3 μm;

3.The total thickness deviation (TTV) of φ150mm wafer is within 4 μm.

Types of samples that can be processed:

Silicon, silicon carbide, diamond, ceramics, gallium nitride, quartz, gallium antimonide, indium phosphide, gallium arsenide, cadmium zinc telluride, mercury cadmium telluride, lithium niobate and other semiconductor materials.

Equipment Features:

1. Realize the end point detection function for controlling the sample thickness.

2. On-line real-time lapping and polishing plate temperature control and cooling function.

3. Multi-channel feeding system.

4. Automatic flushing function of lapping and polishing plate.

5. Automatic plate repair function.

6. The fixture be equipped with a digital thickness monitoring table with a monitoring accuracy of 0.1μm.

Technical parameters:

Model

MDAM-CMP100

MDAM-CMP150  

Wafer size

4 inches and below

6 inches and below

Working plate diameter

420mm

420mm

Station

≤4

≤2

Feed port

≤3

Power supply

220V、10A

Timing

0-10h

Ambient temperature

20℃~35℃

Plate speed

0-120rpm

Fixture rate

0-120rpm

Device Configuration:

Sample fixing system component

Clamp, roller arm

Lapping process assembly

Lapping plate, plate repairing block, and cylinder

Polishing process assembly

Polishing fluid feeding system and polishing plate

Detection component

Test benchmark platform, flatness tester, pressure test gauge

Wafer lapping and polishing material package       

Lapping powder, polishing solution, polishing cloth, wax,  dewaxing fluid, glass substrate sheet

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

 

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

 

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

 

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

 

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

 

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

 

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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