Model: MDAM-CMP100 / MDAM-CMP150
Precision CMP system is mainly used for lapping and thinning of main semiconductor chips such as silicon, silicon dioxide and indium antimonide focal plane chips, and chemical mechanical polishing of
bottom, surface and end face.
MDAM-CMP100 /MDAM-CMP150
Precision CMP System
Equipment Overview:
Precision CMP system is mainly used for lapping and thinning of main semiconductor chips such as silicon, silicon dioxide and indium antimonide focal plane chips, and chemical mechanical polishing of bottom, surface and end face.
The whole machine and all parts of the equipment are fully anticorrosive, and the process parameters be set through the touch screen interactive interface.
Processable sample size:
Sample size ≤152mm/6 inch
Machinable thickness is 50μm ~ 10 mm
Achievable process indicators:
1.The total thickness deviation (TTV) of φ75mm wafer is within 2 μm;
2.The total thickness deviation (TTV) of φ100mm wafer is within 3 μm;
3.The total thickness deviation (TTV) of φ150mm wafer is within 4 μm.
Types of samples that can be processed:
Silicon, silicon carbide, diamond, ceramics, gallium nitride, quartz, gallium antimonide, indium phosphide, gallium arsenide, cadmium zinc telluride, mercury cadmium telluride, lithium niobate and other semiconductor materials.
Equipment Features:
1. Realize the end point detection function for controlling the sample thickness.
2. On-line real-time lapping and polishing plate temperature control and cooling function.
3. Multi-channel feeding system.
4. Automatic flushing function of lapping and polishing plate.
5. Automatic plate repair function.
6. The fixture be equipped with a digital thickness monitoring table with a monitoring accuracy of 0.1μm.
Technical parameters:
Model |
MDAM-CMP100 |
MDAM-CMP150 |
Wafer size |
4 inches and below |
6 inches and below |
Working plate diameter |
420mm |
420mm |
Station |
≤4 |
≤2 |
Feed port |
≤3 |
|
Power supply |
220V、10A |
|
Timing |
0-10h |
|
Ambient temperature |
20℃~35℃ |
|
Plate speed |
0-120rpm |
|
Fixture rate |
0-120rpm |
|
Device Configuration:
Sample fixing system component |
Clamp, roller arm |
Lapping process assembly |
Lapping plate, plate repairing block, and cylinder |
Polishing process assembly |
Polishing fluid feeding system and polishing plate |
Detection component |
Test benchmark platform, flatness tester, pressure test gauge |
Wafer lapping and polishing material package |
Lapping powder, polishing solution, polishing cloth, wax, dewaxing fluid, glass substrate sheet |
Guangzhou Minder-Hightech Co.,Ltd.
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