Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder
  • MDZWSQW-2025 Deep Access Automatic Wedge Bonder

MDZWSQW-2025 Deep Access Automatic Wedge Bonder

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Product Description

MDZWSQW-2025 Deep Access Automatic Wedge Bonder

Micro assembly, multi chip, System in package complex packaging solutions

Product Overview:

1. Targeted solutions for complex packaging of micro-assembled multi-chip and multi-substrate materials.
2. Graphical, global real-time, and unit-level real-time guidance programming for efficient user product integration.
3. Directory-based programming with material-based regional referencing for rapid wire bonding process programming.
4. Material-based regional referencing and database-driven process parameter interaction for high adaptability to multi-chip processes.
5. Efficient algorithm integration for looping, bonding, and tearing, with condensed process parameters.
6. 0°, 45°, and 90° multi-application mode wire clamp for effective adaptation to various process applications.
7. Compatible mounting system equipment platform and control interface.
8. High adaptability for multiple product types, rapid product switching, convenient capacity matching, and extreme process requirements.

Product Features

1. Optical imaging system including RGB, adaptable to various materials such as IC, FR4, HTCC, and LTCC.
2. High-efficiency algorithms for fixed-length/fixed-height looping, bonding, and tearing, with targeted process parameter
optimization for SIP processes.
3. 0°, 45°, and 90° multi-application mode wire clamp, adaptable to multiple process applications.
4. Composite process execution mode, suitable for ultra-large-scale SIP packaging.
5. High-speed direct-drive common platform technology for stability, accuracy, and speed.
6. Self-developed high-speed, high-precision, low-disturbance platform, ensuring low-maintenance accuracy.
7. Visual quick BTO calibration, reducing process dependency.
8. Monitoring, trajectory, and control-based QC monitoring modes.
9. Process-level comprehensive positioning accuracy of ±3um@3σ.
10. Fast and flexible WCL system for precise and high-response performance.
11. Efficient thermal system design for low disturbance at high temperatures.
12. Efficient WP and WT systems for high integration and high performance.
13. Graphical, global real-time, and unit real-time views for guided programming and execution control.
14. Directory-based and area-referenced programming for ultra-fast wire bonding process positioning.
15. Area-referenced and database modes for process parameter interaction.
16. System-level and personalized programs, subroutines, and parameter libraries.
17. Direct Auto Pad Focus assist system.
Application
Integrated circuit packaging, optical communication, microwave, laser, sensor, etc. require chip microassembly
Sample
Specification
Bonding Area
200mm*250mm (with liftable worktable)
200mm*150mm (in-line track, non-standard customized);
Z-axis travel: 50mm, θ-axis travel: unlimited (±180° operation)
Wire Clamp Length
25mm (19mm optional customized Wire Clamp constraint)
Ultrasonic
4W/100KHz (high precision)
Main Camera Field of View
4.2mm*3.5mm or 8.4mm*7.0mm
Auxiliary Camera Field of View (including E_BOX function)
4.2mm*3.5mm or 8.4mm*7.0mm
Equipment Dimensions
1110mm*1350mm*1900mm (width*depth*height) (with liftable worktable)
1400mm*1350mm*1900mm (width*depth*height) (in-line track)
Overall Process Positioning Accuracy
±3um@3σ (±2um@3σ single item evaluation)
Cavity Depth (Whole Area)
15mm (10mm, 19mm wire clamp)
Wire Clamp Angle
0° (45° || 90° optional customized)
Material Handling System
Standard liftable worktable, customizable in-line track
Gold Wire (Aluminum Wire) Diameter
18-100μm (copper wire, ultra-large diameter range single item evaluation)
Bonding Pressure
5~300g Low impact
(Absolute accuracy ±1g@“10g~100g” or 1%@100g~300g, repeatability ±0.5g)
UPH
1~4 Wire/S, related to wire diameter, process & wire loop
Interface Standard
SECS/GEM communication protocol
SMEMA connection standard
Power Supply
AC220V±10%-10A@50HZ
Compressed Air
≥[email protected], purified air source
Vacuum Source
≥50LPM@-85KPa
Weight
1000kg
Packing & Delivery
Company Profile
Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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