Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder
  • MDSY-TCB30 Thermal Compression Bonder

MDSY-TCB30 Thermal Compression Bonder

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Product Description

MDSY-TCB30 Thermal Compression Bonder

The equipment has the function of flip chip gold bumps (and other materials) bonding, which can meet the requirements of heating & pressure bonding and ultrasonic bonding.
1. This machine is high accuracy flip chip Bonder for chip and substrate.
2. Substrates set in trays are set on the mounting stage by the suction head.
3. After picking up and flipping chips, transfers to the mounting head, performs flux dipping (option).
4. Corrects chip position with image recognition, then conducts heat bonding.
5. Also support ultrasonic, and eutectic is option.
6. Also support regular bonding which do not need heating and pressure.

Various Functions:

1. Adjusts parallelism with the automatic leveling mechanism, the parallelism is less than 5μm with the range of 30×30[mm].
2. The parallelism can be adjusted by manual up to 1μm.
3. Automatic flux dipping from flux bath is capable. Flux thickness can be adjusted for the work, and surface is evened by
squeegee in every.
4. Reduced gas (N2、N2+H2 so on) purge jig is used for eutectic bonding.
5. ID reader, reading tray ID, workpiece ID etc. to record production status.
6. The stage has vacuum adsorption function.
7. Bonding process Parameter record, such as work pressure curve. temperature curve, ultrasonic vibration point, ultrasonic pressure and others is capable in every bonding.
8. Work auto supply function.

Mounting Accuracy:

Flip Chip XY：±0.5[μm] * φ8 [inch] area (3σ)
1.Use dedicated evaluation jig at room temperature. (XY Position)
Measured with alignment camera of the machine.
2.Under the clean room environment, room temperature 23±2[℃], humidity 40 to 60[%]
3.The accuracy is when ultrasonic head and ultrasonic are not applied.
Specification
Chip material
Si and others
Chip size
0.3~30mm thickness:0.05 ~1.0 [mm]
Supply methods
2,4 Inch tray (waffle tray, gel-pak, metal tray etc)
Substrate material
SUS, Cu, Si, work piece, ceramic and others
Tray amounts
2inch tray up to 8, or 4inch tray up to 2;Tray can be freely set for chip or substrate.
Substrate outer size
15~50 [mm]& 8 [inch] wafer
Substrate thickness
Flat shaped base plate 0.1~3.0[mm];
Tube shaped bottom plate:A:0.1~2[mm] B:≤5[mm],C:≤7[mm]
The minimum distance from the chip to the inner wall of the can D: 21mm
UPH
Approx 12 [sec/cycle] [Conditions of cycle time]
Mounting Head Drive Section
Z axis
Resolution
0.1[μ m]
Movable range
200[mm]
Speed
Max.250[mm/sec]
θ axis
Resolution
0. 000225[°]
Movable range
±5[°]
Chip holding
Vacuum suction method
Recipe change
ATC (automatic tool changer) method Maximum number of jigs to be changed: 20x20[mm] 6 types *2 types when 30x30[mm] (option) is
used.
Pressure load section:
Set range
Low load range:0.049 to 4.9[N](5 to 500[g])
High load range:4.9 to 1000[N](0.5 to 102[kg])
* Load control that covers both range is not possible.
* Ultrasonic horn is only for high-load area
Pressure accuracy
Low load range: ±0.0098[N](1[g])
High load range: ±5[%](3σ)
* Both accuracies are for RT actual load.
Mounting Head Pulse Heat Section
Heating method
Pulse heat method (Ceramic heater)
Set temperature
RT~450[°C] (1[°C] step)
Temperature rising speed
Max80[°C/sec] (without ceramic jig)
Temperature distribution
+5[°C] (30x30[mm] area)
Cooling function
With heat tool, work cooling function
Ultrasonic horn section
Oscillation frequency
40[kHz]
Vibration range
Approximately 0.3 to 2.6[µ m]
Heating method
Constant heat method (ultrasonic horn)
Set temperature
RT~250[°C] (1[°C] step)
Tool size
M6 tool replacement types (screw in type)
*Needs to change to the rigid type for more than 7x7[mm] chip size.
Others
Need to replace with pulse heat head.
Ceramic heater for mounting stage 1
Mounting area
50×50 [mm]
Heating method
Ceramic heater
Set temperature
RT~450[°C] (1[°C] step)
Temperature distribution
+5[°C]
Temperature rising speed
Max70[°C/sec] (without ceramic jig)
Cooling function
Available
Work holding
Vacuum suction method
Recipe change
Jig change
Constant heater for mounting stage 2
XY stage
Constant heater
Stage for main bonding
Mounting area
200×200 [mm] (48 [inch] area)
Heating method
Constant heat
Set temperature
200×200 [mm]: RT to 250[°C] (1[°C] step)
Temperature distribution
±5% (200×200 [mm])
Work holding
Vacuum suction method
Recipe change
Jig change
Packing & Delivery
Company Profile
Since 2014，Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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