0,65х0,65
4,6х4,6
2,7х1,6
2,0х1,6
1,55х1,15
2,3х1,75
1,6х1,4

|  Project |  Parameters | 
|  Equipment Name |  MDND-120UT multi-function die bonder | 
|  Equipment Model |  MDND-120UT | 
|  Bonding Accuracy/Angle |  ±20um, ±0.5 (calibration film) | 
|  Bond Force |  50~2000gf | 
|  CPH |  1000 (50ms process time, final efficiency depends on process and process time) | 
|  Chip Size |  0.5~15mm | 
|  Dustproof Level |  Class 1000 | 
|  Compatible Substrate/Tray |  MAX: 300*200mm | 
|  Compatible Auxiliary Material Fixture |  Expander Rings: 4"/6" * 3pcs, 8"*1pcs | 
|  Equipment Size |  Wafer Ring: 4"/6"/8"/12" * 1pcs | 
|  Weight |  1610 x 1420 x 1700mm | 


















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