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  • MDICP-5000F Fully Automatic ICP Etching Machine
  • MDICP-5000F Fully Automatic ICP Etching Machine
  • MDICP-5000F Fully Automatic ICP Etching Machine
  • MDICP-5000F Fully Automatic ICP Etching Machine

MDICP-5000F Fully Automatic ICP Etching Machine

Model: MDICP-5000F

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MDICP-5000F Fully Automatic ICP Etching Machine
MDICP-5000F Fully Automatic ICP Etching Machine / Semiconductor equipment Inductively Coupled Plasma factory
MDICP-5000F Fully Automatic ICP Etching Machine / Semiconductor equipment Inductively Coupled Plasma factory

Executive summary:

The equipment is a two chamber vacuum system. One chamber is the injection sampling chamber and the other is the etching chamber. A vacuum lock is installed between the injection sampling chamber and the etching chamber, and the injection sampling is transported by manipulator.
The equipment is mainly composed of vacuum system, gas circuit system, electrical system, control system, cooling system, film feeding and taking mechanism, alarm system, etc.

Vacuum system:

The system consists of a molecular pump with a pumping speed of 600 L / S + an imported vacuum dry pump with a pumping speed of L / s to pump the etching chamber to high vacuum. An electric dynamic pressure regulating valve is installed between the molecular pump and the etching chamber. The imported dry pump is the pre pumping pump of the etching chamber and the front stage pump of the molecular pump. Use another mechanical pump with pumping speed of L / s to vacuum the sample chamber. Stainless steel bellows are used for connection between mechanical pump and vacuum chamber and molecular pump, and electromagnetic pneumatic block valve is installed.

Constant pressure control system

The equipment is equipped with a downstream constant pressure control system, and an electric adjustable valve is installed in the air extraction pipeline. Through the measurement of film gauge (imported parts), the adjustable valve is controlled to make the vacuum chamber reach constant pressure, so as to improve the process stability.

Constant pressure control system

The equipment is equipped with a downstream constant pressure control system, and an electric adjustable valve is installed in the air extraction pipeline. Through the measurement of film gauge (imported parts), the adjustable valve is controlled to make the vacuum chamber reach constant pressure, so as to improve the process stability.

Gas circuit system

Two sets of RF power supply with automatic matching.

Alarm system

Safety requirements for equipment.
Specification
Name
Spc
Brand
No./Set
Note
Etching chamber, air extraction pipeline, observation window, reserved interface, etc
Standard
JSWN
1
Anticorrosive
Frame, electric cabinet, seals, standard parts, etc
Standard
JSWN
1
Etching chamber cover lifting system
Standard
JSWN
1
Anticorrosive
Etching electrode and cooling system
Standard
JSWN
1
Anticorrosive
Molecular pump (pumping speed 600 L / s)
FF620/150
KYKY
1
Anticorrosive
Inlet dry pump (pumping speed 9 L / s)
XDS-35I
EDWARDS
1
Anticorrosive
Mechanical pump (pumping speed 9 L / s)
TRP-36
BWVAC
1
Electric regulating gate valve
DCQ-150
JSWN
1
Anticorrosive
Pneumatic bellows stop valve
KF40
JSWN
3
Anticorrosive
Film gauge
KF16
INFICON
1
Anticorrosive
Mass flow controller
D07
Sevenstar
4
Anticorrosive
Pneumatic diaphragm valve
1/4″VCR
-
4
Anticorrosive
Stainless steel pipe, pipe joint, etc
1/4″VCR
-
4
Anticorrosive
RF power supply / automatic matcher
-
China(OptionalCROWN1310)
1
RF power supply / automatic matcher
-
China(OptionalCROWN1310)
1
Composite vacuum gauge
ZDF
RB
1
IPC
2U
China
1
LCD touch screen
17inch
China
1
PLC control system
S7-200
Siemens
1
Electric drive control system
Standard
JSWN
1
Cooling water detection and pipeline system
Standard
JSWN
1
Compressed air detection and pipeline system
Standard
JSWN
1
Cooling circulating water machine
HX
China
1
Etching injection chamber
Standard
JSWN
1
Vacuum lock
SMC
SMC
1
Manipulator control system
SMC
SMC
1

Mail technical parameter

1. Limit vacuum: Etching chamber 9.0×10-5Pa (Indoor humidity≤55%)
Injection sampling chamber 6.0×10-1Pa
2. Etching material: Ⅲ、ⅤMaterial、Si 、SiO2,etc
3. Etching rate: ~ 1μ/min
4. Etching uniformity: ≤±5％(φ125mm range)
6. Electrode size: φ200mm

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

 

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

 

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

 

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

 

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

 

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

 

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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