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Model: |
DSX-25-071 |
Mounting method. |
Fixed pressure plate |
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Positioning Method: |
None |
Heating system: |
Heating plate (0-120°C) |
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Air Pressure: |
0.6-0.8Mpa |
Total power: |
500W |
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Machine Voltage: |
AC220V |
Operating mode: |
Semi-automatic |
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Rated voltage |
AC 220V |
Frequency |
50/60HZ |
Power |
<400W |
Pressure |
0.5~0.6Mpa |
Machine weight |
50kg |
Film type |
UV / PVC material film / blue film |
Film thickness |
0.05~0.2mm |
Table heating temperature |
0-80℃ |
Membrane expanding function |
Semi-automatic |
Film cutting function |
Automatic film cutting |
Process |
After Semiconductor/Led Wafer Dicing |


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