Maximal Diameter of Cutting Ingot |
¢153mm |
Blade Standard |
¢690mm×¢241mm×0.15mm or ¢690mm× ¢235mm×0.15mm |
Maximal Length of Cutting Ingot |
350mm |
Range of Wafer Thickness |
0.2〜~99mm/min |
Cutting speed |
0.001〜~68.00mm |
Adjustment only of Crystal Direction |
0.001mm |
Adjustment of Crystal Direction |
Horizontal range(x)±7°(resolution:2') Vertical range(Y)±7º(resolution:2') |
Power |
3.5kw,〜380v±38v, 50HZ±1HZ |
Source of Air |
0.4〜0.5MPa,250L/min(instantaneous flux when braking) |
Sour of Cooling Water |
0.2〜~0.4mpa;5L/min |
Touching Panel |
7.7inch |
Dimension |
1610mm×1100mm×2070mm |
Weight |
2800kg |
English interface |
|
Stepping deviation of feeding |
±0.005mm(testing with l mm feeding step) |
Return Speed: |
1〜~1000mm/min |
The speed of main spindle: |
1420r/min |
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