Model: MDST-6100
The ICP dry plasma asher is suitable for applications such as descumming (pre-treatment and residue removal), polymer removal (PI, BCB, PBO), and post-ion implantation photoresist removal; the chamber accommodates 8-inch samples (with compatibility for 4-inch and 6-inch sizes).
ICP Dry Plasma Photoresist Stripper
The ICP dry plasma asher is suitable for applications such as descumming (pre-treatment and residue removal), polymer removal (PI, BCB, PBO), and post-ion implantation photoresist removal; the chamber accommodates 8-inch samples (with compatibility for 4-inch and 6-inch sizes).
The appearance of the equipment is subject to continuous upgrades and adjustments; the actual shipped product shall prevail.



Advantage:
High degree of plasma ionization and decomposition
After plasma treatment, the reproducibility is high
Dry etching, no pollution source
Control pressure and temperature through butterfly valves
Can maintain plasma at high pressure
Separation of High Voltage Source and Ion Generator
Microwave junction and magnetic circuit are compatible
Can meet customer requirements
Low temperature during processing
Fast response speed and short response time



Model |
MDST6100 |
PLASMA source |
radio frequency |
power |
1000W |
Scope of Application |
8 inches (compatible with 4 or 6 inches) |
Box size |
25 pieces |
Overall Dimensions |
L1696xW2170xH2146mm |
System Control |
PLC |
Material box system |
Automatic |
Actual Photos of Equipment:








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