Full Automatic Taiko Vacuum Wafer Mounter , China Full Automatic Taiko Vacuum Wafer Mounter Manufacturers, Suppliers, Factory

Product Description

MDVWM-TK08 Full Automatic Taiko Vacuum Wafer Mounter

1. Fully automated 8-inch Taiko Wafer back cover developed for the semiconductor industry
2. Dedicated Equipment for Dicing Tape
3. Supports Taiko wafers with a thickness of 50 µm or greater

Floor Plan and Operational Flow:

Equipment Configuration and Key Technical Parameters:

Number	Item	Content	Remarks
1	Product Dimensions	8 inch	Taiko Wafer
2	Loading Method	8 inch Open Cassette	Customizable per customer requirements
3	Unloading Method	8 inch frame cassette	Dual-Cassette Mechanism
4	Applicable Frame	8 inch
5	Product Thickness	8”>50um
6	Product Transport	Robot	Bernoulli
7	Positioning Mechanism	CCD + Mechanical
8	Film Lamination Mechanism	Vacuum mounted
9	Vacuum Sealing Integrity	20.2hpa	Dry Pump
10	Applicable Film Types	Blue tape & UV tape
11	Supported Warpage	<2mm	Customizable per customer requirements
12	OCR Reader	Cognex 1741
13	WPH (Units per Hour)	>25pcs	Tailored to actual product process requirements
14	ESD Protection	Balance voltage < 30V; (±1000V to 5V) < 5s.
15	Controller	PC	Windows base
16	Display	15inch color touch screen
17	Operating System	Windows 10
18	Networking System	SECS GEM
19	Monitoring System	CCTV
20	Purification System	FFU	H13/H14

Load Port Unit：

1. Compatible with 8-inch Open Cassettes
2. Cassette Misplacement Detection Function
3. Mapping Scan Function

ESD Control Unit：

1. Static Eliminator Bars
Pre-lamination Area: 2 units
Positioning Area: 1 unit
Loading Area: 1 unit
Unloading Area: 1 unit
Other Areas: (Optional)
2. ESD Control: 1000V → 30V (Achievable within 5 seconds)

Wafer Transfer Robot:

Non-Contact Gripper or Bernoulli Arm

Wafer Alignment Unit:

Automatic Positioning (Bernoulli Chuck Alignment or Taiko Edge Clamping) CCD Notch Alignment

Vacuum Lamination Unit:

1. Contact-type vacuum stage with silicone soft pad (customizable according to customer requirements)
2. Height-adjustable lamination stage
3. Supports 8-inch frames
4. Vacuum pump: Dry pump (oil-free)

Frame Placement Area:

1. Supports 8-inch frames
2. Automatic height measurement and positioning
3. Double-ring detection

Labeling Unit:

1. Labeling turntable rotatable 360 degrees
2. Labeling position is programmable
3. High-speed SATA printer; label length and width are adjustable
4. Vacuum label suction head (for secondary verification of printed barcodes)

Operation Results:

Experimental Findings: When a vacuum level of 0.8 hPa was achieved, the results appeared as shown in the figure below; the unadhered gap at the step feature measured less than 1 mm.
When a vacuum level of 0.2 hPa was achieved, the unadhered gap at the step feature measured approximately 0.6 mm.

Symbol	ltem	Request
A	Wafer size (mm)	200
B	Wafer original thickness (um)	550
C	Narrower ring width (mm)	2.4
D	Wider ring width (mm)	2.9
E	Wider ring height (um)	130
I	Wafer finish thickness (um)	80

Equipment Dimensions:

Packing & Delivery

Company Profile

Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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Full Automatic Taiko Vacuum Wafer Mounter