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  • Failure Analysis Wafer Prober
  • Failure Analysis Wafer Prober

Failure Analysis Wafer Prober

Product Introduction

MDSM-FA series prober is a measuring equipment specially designed for failure analysis laboratory. It has optical and laser characteristics, stable equipment structure, excellent system performance, intuitive, convenient operation, support multi-function upgrade, and rich and complete product functions.

Product Features

1.Probe card support to improve the efficiency of contacting;

2.The chuck can be raised and lowered for quick probe separation from the sample;

3.Standard metallographic microscope, Pad test above 1µm;

4.Microscope air-controlled lift adjustment;

5.Multi-band laser application, fast switching and precise cutting.

Product Parameters

Model

MDSM-FA-H

MDSM-FA-C

Chuck

Minimum displacement

1μm

1μm

Temperature range

RT~300

-60℃~300℃

Pull out quickly

N/A

Travel 290mm

Microscope

Standard PSM-1000 metallographic microscope, which can be magnified to 2000X; The microscope can be adjusted by air control

Laser characteristics

Micromachining capability

1064/532/355/266nm bands can be selected

power

Output power 2.2mJ/pulse (upgradeable)

band

Machinable materials: Cr/Al/ITO/Ni/TFT/RGB/Poly Silicon/Mo/SiN/CF impurities, etc.

precision

The minimum machining accuracy is 1*1μm (with 100X lens)

cooling method

Choice of air-cooled laser or water-cooled laser

EMI shielding

N/A

 

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