Application:
This ginder is suitable for high hardness, thin, and high precision product. like LED sapphire substrate, quartz crystal, silicon wafer, ceramic, wolfram plate, germanium plate thinning(grinding)
Principle:
This machine is automatic precision grinding machine, the sucker/chuck(either vacuum type or electromagnetism type) suck the wafer and rotary opposite from the grinding wheel, the grinding wheel feeding by driving system. this method has low drag force, will not broke the wafer, and high productivity.
This machine can auto aiming the tool, actually test the grinding torque, automatic adjust the grinding speed, so to avoid broking the wafer.
1, Can grind the wafer to 80um, and the planeness and parallelism can be +-0.002mm.
2, High speed, LED sapphire substrate can be 48um/minute, silicon wafer can be 250um/minute.
Specification:
Model |
MDYM-150WH |
MDYM-180WH |
MDYM-200WH |
MDYM-230WH |
MDYM-300WH |
Grinding wheel |
D150*h25mm |
D180*h25mm |
D200*h30mm |
D230*h30mm |
D300*h30mm |
Max material size |
D150mm |
D180mm |
D200mm |
D230mm |
D300mm |
Material spindle speed(adjustable) |
0-1000rpm |
0-1000rpm |
0-800rpm |
0-800rpm |
0-800rpm |
Grinding wheel speed(adjustable) |
0-2000rpm |
0-2000rpm |
0-1800 rpm |
0-1800 rpm |
0-1800 rpm |
Grinding wheel motor power |
1.5kw/3*380V |
1.5kw/3*380V |
2.2kw/3*380V |
2.2kw/3*380V |
2.2kw/3*380V |
Material spindle motor power |
0.75kw/3*380V |
0.75kw/3*380V |
0.75kw/3*380V |
0.75kw/3*380V |
1.1kw/3*380V |
Parallelism |
1um(for D100mm) |
1um(for D100mm) |
1um(for D100mm) |
1um(for D100mm) |
1um(for D100mm) |
Dimension(mm) |
1200*550*1550 |
1200*550*1550 |
1350*600*1600 |
1350*600*1600 |
1500*700*1650 |
Weight |
760kg |
850kg |
960kg |
1000kg |
1100kg |
OTHER DETAILS:
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Minder-Hightech
Introducing the Wafer Grinder Disco DFG8560, brought to you. This versatile and efficient machine is perfect for all your wafer grinding needs, whether you are a professional manufacturer or just need to grind a few wafers for DIY projects.
The Disco DFG8560 is capable of handling a wide array of wafer sizes and materials with its effective Minder-Hightech motor and easy-to-use design. Its accuracy mechanism is grinding that the wafers are completely ground every time, with just minimal waste or damage to the delicate materials.
Among the standout features of the Disco DFG8560 is its size is compact and. This wafer grinder is effortless to move around and store, making it the right choice for small workshops or labs where space is at a premium unlike bigger, more cumbersome machines.
Another big advantage of the Disco DFG8560 is its user-friendly settings and program is intuitive. You will appreciate how simple it is always to arranged and operate this machine whether you are a seasoned professional or perhaps a novice individual. You can quickly adjust the speed is grinding pressure, and other settings to achieve the right outcomes every time.
Of course, in regards to virtually any bit of gear, durability and reliability are key. with all the Minder-Hightech name it is possible to trust that the Disco DFG8560 is built too final behind it. for occasional DIY projects or day-to-day professional use, this wafer grinder will offer a long time of trouble-free performance whether you are utilizing it.
Order your Disco DFG8560 today and start experiencing the benefits of this top-of-the-line wafer grinder for yourselves.
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