



| Project | Content | 
| Product Type | 6",8",12" wafer, 2.5D/3D packaging | 
| 2D Inspection Items | Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive needle marks, etc. | 
| 2D Metrology | Bump diameter, needle mark coordinates, RDL and TSV metrology, etc. | 
| 3D Inspection Project | Bump height, Bump coplanality | 
| Cassette &Transmission Method | 8"SMIF , 12" FOUP or combination | 
| Lens and Resolution | 2x(2.75um)13.5x(1.57um)5x(1.1um)17.5x(0.73um)110x(0.55um) | 
| Precision | 0.55um/pixel | 
| Optional and Customized | Double sided OCR,3D module, supported by E84 | 









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