Suitable for compound semiconductor wafer materials such as GaAs, InP, etc. with a size of 6 inches or less, automatic cutting and cleavage specialized equipment.
Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.
AutomaticWafer Cleaving Machine
Suitable for compound semiconductor wafer materials such as GaAs, InP, etc. with a size of 6 inches or less, automatic cutting and cleavage specialized equipment. Widely used in laser devices, photodetectors, and microwave devices for cleavage segmentation.
Application:
Application of III-V compound semiconductor materials, GaAS/II-V RFIC, Bio-Medical Chips, Silicon/MEMS, Sl Photonics, LEDS, Laser Diodes.
Features:
Low COO, Robust Platform;
High Precision Positioning;
Vibration Free Stage Design;
Automatic Processing;
Advanced Software Functions;
Accommodates Multiple Break/Process Modules.
Cutting head |
X direction |
Travel range: 160mm |
Roller pressure |
0~100gf |
Positioning accuracy: 3 μ m |
Knife pressure |
0~20gf |
||
Y direction |
Travel range: 160mm |
Equipment weight |
About 150kg |
|
Positioning accuracy: 3 μ m |
Lens Y direction |
Travel range:160mm |
||
T direction |
360 degree rotation |
External dimensions |
1170mmx730 mmx500mm |
|
Wafer size |
Suitable for 6-inch (150mm) wafers |
Operation interface |
23.8 "TFT color screen, Chinese interface |
|
Image system |
4.0X magnification (2.0X optional) |
Control system |
Windows 7 operating system, dedicated control software for cleavage machines |
|
Standard configuration |
Host \ Computer \ 23.8 "Display \ ESD Splitting Machine Control Software \ Mouse and Keyboard |
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FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
2. About Sample:
We can provide sample production services for you, but you may provide some fees.
3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
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