Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection
  • Automatic Optical Inspect AOI Wafer 2D Defect Inspection

Automatic Optical Inspect AOI Wafer 2D Defect Inspection

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Product Description

Wafer 2D Defect Inspection System

Introduction to Main Modules

EFEM:
1.Manual loading of 8-inch or 12-inch open cassettes at the feeding station and automatically switch the product track size for compatibility.
2.The robot adopts a drag-and-drop design, ignoring the influence of interlayer spacing.
3.With a material pushing interference alarm, there is a buffer distance and sensor alarm when the product is blocked.
STAGE:
1.Flying image acquisition for inspection.
2.Reserved stations can be equipped with optional INK modules or IR modules.
3.Achieves sub-micron level accuracy.
4.Delivers results with minimal waiting time.

Software Introduction

1.Supports multi-level permissions and permission operation logging functionality.
2.The equipment menu bar covers a wide range of functions.
3.Automatically generates mapping and production reports.
4.Real-time display of task status.
5.Combination of traditional algorithms and AI for fast and accurate identification of defects.
Specification
Project
Content
Product Type
6", 8", 12" frame wafer
2D Inspection ltems
Foreign objects, residual glue, particles, scratches, cracks, contamination, CP deviation, excessive area, etc
Cutting channel deviation and chipping
Cutting Path Inspection Items
6", 8", 12" frame cassetee
Lens and Resolution
2x（2.75um）/3.5x（1.57um）/
5x（1.1um）/7.5x（0.73um）/10x（0.55um）
Precision
0.55μm/pixel
Optional and Customized
INK module, IR module
Packing & Delivery
To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. The company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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