Automatic Desktop Wire Wedge Bonder

Applicability

1. "Real-time" Manual Control & Automated Functionality with High Coverage; "Live-View" Dual-Camera Configuration for Real-Time Visualization of the Wire Bonding Process

2. Optical Imaging System (including RGB) Adapted for Visual Inspection of Multiple Material Substrates: IC, FR4, HTCC, and LTCC

3. High-Efficiency Algorithms for Fixed-Length and Fixed-Height Looping, Bonding, and Tearing; Process Parameter Optimization Tailored Specifically for SiP Applications

4. "0°, 45°, & 90°" Multi-Application Wire Clamp Modes; Patented Fine-Wire Cutter Option Compatible with 75µm–100µm Aluminum Wire Bonding

Stability

5. High-Speed Direct-Drive Platform Technology: Stable, Precise, and Rapid Performance

6. Proprietary "High-Speed, High-Precision, Low-Disturbance" Platform Design, Ensuring Sustained Accuracy with Minimal Maintenance Requirements

7. Monitoring, Trajectory, and Control Modes; Real-Time QC Waveform Monitoring to Ensure Optimal Bonding Quality

Accuracy

8. Comprehensive Process-Level Positioning Accuracy: ±3µm @ 3σ

9. Rapid and Flexible Wire Clamp (WCL) System with High Precision and Responsiveness

10. High-Efficiency Thermal System Design Minimizing Thermal Disturbance at Elevated Temperatures

11. High-Efficiency Workpiece (WP) and Wire (WT) Handling Systems: High Integration and High Performance

Ease of Use

12. "Graphical, Global Live-View, and Unit-Specific Live-View" Interfaces for Guided Programming and Operation Control

13. "Directory-Based & Area-Referenced" Modes for Ultra-Fast Wire Bonding Position Programming; "Area-Referenced & Database-Driven" Modes for Process Parameter Management

14. "System-Level & User-Specific" Management of Programs, Subroutines, and Parameter Libraries

15. "Direct Auto-Pad & Auto-Focus" Auxiliary System for Enhanced Operational Support

1

Bonding Travel

200 x 200 mm (Customizable to 250 x 300 mm)

2

Integrated Process Positioning Accuracy

±3 µm @ 3σ (±2 µm @ 3σ for individual parameter evaluation)

3

Z-axis Travel

50 mm

4

θ-axis Travel

Unlimited (±180° operation)

5

Gold (or Aluminum) Wire Diameter

18–100 µm (Wire diameters outside this range require individual evaluation)

6

Capillary Length

25 mm (19 mm available as a custom option; subject to Wire Clamp constraints)

7

Cavity Depth

Whole area: 15 mm (10 mm with 19 mm capillary)

8

Bonding Force

5–300 g (Low Impact)

9

Absolute Accuracy

±1 g within the 10–100 g range, or ±1% within the 100–300 g range; Repeatability: ±1 g

10

Compressed Air

≥10 LPM @ 0.5 MPa (Purified air source required)

11

Vacuum Source

≥50 LPM @ -85 kPa

12

Ultrasound

4 W / 100 kHz (High Precision)

13

Wire Clamp Orientation

0° (45° or 90° available as custom options)

14

UPH (Units Per Hour)

 1–4 wires/sec (Varies based on wire diameter, process parameters, and wire loop profile)

15

Main Camera Field of View (FOV)

4.2 x 3.5 mm or 8.4 x 7.0 mm

16

Material Handling System

Standard fixed worktable included; custom fixtures available

17

Equipment Dimensions

590 mm (W) x 690 mm (D) x 800 mm (H)

18

Weight

150 kg

19

Power Supply

AC 220 V ±10%, 10 A @ 50 Hz

20

Power Consumption

≥2200 W

21

Interface Standard

SECS/GEM Communication Protocol