Automatic Desktop Wire Ball Bonder

Applicability

1. "Real-time" Manual Control II: Automated functions with extensive coverage; "Live-View" Dual-Camera Configuration: Real-time visualization of the wire bonding process.

2. High-Efficiency Algorithms: Fixed-length and fixed-height looping, bonding, and tearing; process parameter optimization specifically tailored for SIP applications.

3. "Integrated" Active Tail Control: Effectively adapts tail wire management to accommodate bonding across a wide variety of material types.

4. Ball Bumping, Dual-Ball Bumping, BBOS, BSOB, etc.: A comprehensive process system designed for SIP compatibility.

Stability

5. High-Speed Direct-Drive Common Platform Technology: Stable, precise, and rapid performance.

6. Proprietary "High-Speed, High-Precision, Low-Disturbance" Platform: Ensures sustained precision with minimal maintenance requirements.

7. Monitoring, Trajectory, and Control Modes: Real-time QC waveform monitoring to guarantee bonding quality.

Accuracy

8. Process-Level Comprehensive Positioning Accuracy: ±3µm @ 3σ.

9. Fast and Flexible WCL System: High precision and rapid response capabilities.

10. High-Efficiency Thermal System Design: Minimal thermal disturbance even under high-temperature operating conditions.

11. High-Efficiency WP & WT Systems: Highly integrated design delivering superior performance.

Ease of Use

12. "Graphical, Global Live-View, and Unit-Specific Live-View" Interfaces: Guided programming and operational control.

13. "Directory-Based & Area-Referenced" Modes: Ultra-fast programming of wire bonding positions; "Area-Referenced & Database-Driven" Modes: Interactive management of process parameters.

14. "System-Level & User-Specific" Management: Comprehensive libraries for programs, subroutines, and parameters.

15. "Direct Auto-Pad & Auto-Focus" Auxiliary Systems.

1

Bonding Travel

200 x 200 mm (Customizable to 250 x 300 mm); Z-axis: 50 mm; θ-axis travel: ±90°

2

Integrated Process Positioning Accuracy

±3 µm @ 3σ (±2 µm @ 3σ for individual parameter evaluation)

3

Gold Wire Diameter

12–50 µm (Silver and copper wires available via non-standard customization; diameters outside this range require individual evaluation)

4

Electronic Flame-off (EFO)

Multi-profile real-time control (Supports gold wire diameters up to 75 µm)

5

Cavity Depth

7 mm / 10 mm (using capillary lengths of 16 mm / 19 mm, respectively)

6

UPH (Units Per Hour)

1–4 wires/sec (dependent on wire diameter, process parameters, and wire loop profile)

7

Bonding Force

5–300 g (Low Impact)

8

Absolute Accuracy

±1 g (within the 10–100 g range) or ±1% (within the 100–300 g range); Repeatability: ±1 g

9

Compressed Air

≥10 LPM @ 0.5 MPa (Clean, filtered air source required)

10

Vacuum Source

≥50 LPM @ -85 kPa

11

Ultrasound

4 W / 100 kHz (High Precision)

12

Capillary Length

16 mm / 19 mm

13

Bonding Span

0.15 mm – 8 mm (Spans > 8 mm require individual evaluation) (Tested using standard substrates)

14

Main Camera Field of View

4.2 x 3.5 mm or 8.4 x 7.0 mm

15

Material Handling System

Standard fixed worktable (Customizable fixtures/tooling available)

16

Equipment Dimensions

590 mm (W) x 690 mm (D) x 800 mm (H); Weight

17

Weight

150 kg

18

Power Supply

AC 220 V ±10%, 10 A @ 50 Hz

19

Power Consumption

≥2200 W

20

Interface Standard

SECS/GEM Communication Protocol