Automatic Desktop Heavy Wire Bonder

Applicability

1. "Real-time" Manual Control II: High coverage of automated functions; "Live-View" Dual-Camera Configuration: Real-time visualization of the wire bonding process.

2. Optical Imaging System (including RGB): Adaptable vision capabilities for diverse materials such as FR4, ICs, HTCC, and LTCC.

3. High-Efficiency Algorithms for Fixed Length & Fixed Height: Optimized process parameters specifically tailored for Looping, Bonding, Tearing, and SiP processes.

4. Rapid Switching & Compatibility for Multiple Application Modes: Supports 45–60° Wire Clamps, 90° Wire Clamps, and various cutting methods (Front Cut, Front Air Cut, Rear Cut).

Stability

5. High-Speed Direct-Drive Common Platform Technology: Ensures stability, precision, and speed.

6. "Vision-Guided" Rapid BTO Calibration.

7. Self-Developed "High-Speed, High-Precision, Low-Disturbance" Platform: Guarantees precision with minimal maintenance requirements.

8. Monitoring, Trajectory, and Control Modes: Real-time QC waveform monitoring to ensure bonding quality.

Accuracy

9. Process-Level Comprehensive Positioning Accuracy: ±3µm @ 3σ.

10. Rapid, Flexible WCL System: Features precision air-cutting technology.

11. "Direct-Access" AutoPad and Auto-Focus Assistance Systems.

12. "Efficient & High-Precision" In-line Pull Test QC: Point-by-point inspection.

Ease of Use

13. "Graphical, Global Live-View, and Unit-Specific Live-View" Interfaces: Guided programming and operational control.

14. "Directory-Based & Area-Referenced" Modes: Ultra-fast wire bonding position programming; "Area-Referenced & Database-Driven" Modes: Interactive management of process parameters.

15. "System-Level & User-Specific" Management: Comprehensive libraries for programs, sub-programs, and parameters.

1

Bonding Travel

200 x 200 mm (Customizable to 250 x 300 mm)

2

Wire Diameter

Heavy Aluminum Wire: 100–500 µm

3

Heavy Copper Wire

100–300 µm (300–500 µm optional)

4

UPH (Units Per Hour)

1–2 Wires/s (Dependent on wire diameter, process parameters, and wire loop profile)

5

Bond Tool (Capillary)

2-inch (50 mm)

6

Cavity Depth

≥ 18 mm (Subject to WCL configuration and near-wall clearance assessment)

7

Wire Cutting Method

Front Cut, Rear Cut, or Front Air Cut

8

Bonding Force

5–2500 g (Low Impact)(Absolute Accuracy: ±1 g @ 10–100 g; ±1% @ 100–300 g; ±2.5% @ 300–2500 g; Repeatability: ±1 g)(50–5000 g optional)

9

Wire Loop Profile

Fixed Length, Fixed Height

10

Ultrasound

90 W / 60 kHz

11

Main Camera Field of View

4.2 x 3.5 mm or 8.4 x 7.0 mm

12

Material Handling System

Standard Fixed Work Table (Customizable fixtures available)

13

Power Supply

AC 220 V ±10% @ 10 A, 50 Hz

14

Power Consumption

≥ 2200 W

15

Equipment Dimensions

590 x 690 x 800 mm (Width x Depth x Height)

16

Weight

150 kg

17

Vacuum/Air Source

≥ 50 LPM @ -85 kPa