8inch Dicing Saw For Semiconductor Industry
The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece;
DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved;
the equipment performance is stable, the reliability is high, and the maintenance cost Low.
Features:
1. Blade database management;
2. Workpiece cutting database management;
3. Auto focus function;
4. Two-way lifting knife cutting function;
5. Compensation function for blade exposure;
6. Multiple safety guarantees and alarm functions.
Application Fields:
IC, Optics & Optoelectronics, Communications, LEDs, MEMS, Medical Devices, NTCs, Scintillation Crystals, Diodes, Transistors, etc.
Precision-Cuttable Materials:
Silicon Wafers, Gallium Arsenide, Lithium Niobate, Aluminum Oxide, Ceramics, Glass, Quartz, Sapphire, PCBs, and Crystals.