12 inch Dicing Saw For Semiconductor Industry:
The precision scribing machine is equipped with a 15-inch LCD touch screen, GUI interface is friendly, easy to align the workpiece;
DS-300 software control system is adopted, the frame is reasonable, the operation is convenient, and the production efficiency is improved;
the equipment performance is stable, the reliability is high, and the maintenance cost Low.
Features:
1. Blade database management;
2. Workpiece cutting database management;
3. Auto focus function;
4. Two-way lifting knife cutting function;
5. Compensation function for blade exposure;
6. Multiple safety guarantees and alarm functions.
Application:
IC, Optical Optoelectronics, Communications, LED package, QFN package, DFN package, BGA package
Material suitable:
Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board