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Bahay> Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder
  • Automatikong TO Laser Tube Wire Bonder

Automatikong TO Laser Tube Wire Bonder

Paglalarawan ng Produkto

Awtomatikong TO Laser tube wire bonder MD-KTO94

1. Ang makina ay kumakatawan para sa TO56 laser diode packaging
Para sa TO56 laser diode patag at gilid na paghuhusay, awtomatikong pagsasamahang at pag-uunlad ng equipamento.

2. Mataas na kamati-sariwa
Husayin ang TO56 laser diode, maaaring magpatugma ang mahabang at maikling pin. Gitnang bahagi ng paghuhusay.

3. Mataas na katatagan
Ang Bangtou ay gumagamit ng optical deletion ruler na inaimport mula sa Alemanya at ang pinakamagandang boses na coil motor, mataas na bilis at matatag na pagkilos ng husay.

4. Mataas na bilis ng pagproseso
Siklo ng husay: 80ms/W
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Espesipikasyon
Visual system
Lente ng makinaryang pananaw:
1.8 beses
Stereomicrolens:
15 beses, 30 beses
Ring lighting:
Puting super brillante LED liwanag na maaaring adjust ang kaliliran
Paggamit na ilaw:
Pinakamalaking kapangyarihan 3W
paggawa ng buto
Paraan ng pagsisiyasat:
Mga negatibong elektron na nag-i.spark sa mga bola
Oras ng pagkakabus ng bola:
0~25.5ms
Dagok ng kurrente sa ilaw:
0~20mA
Ultrasonic Generator
Ultrasonic power 0 ~ 1.0 W
Oras ng pagtutulak:
(1) Unang oras ng pagweld: 0~255ms
(2) Ikalawang oras ng pagweld: 0~255ms
Ultrasonic Frequency
138KHZ
Pagsasawi ng frekuensiya sa proseso ng pagweld
Awtomatikong hikayatin at sunod-sunuran ang resonant na frekwensiya ng transducer
Detalye ng Kagamitan
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Ang Aming Fabrika
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Packing at Pagpapadala
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture

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