Taiko-väferringsskärningsmaskin, kinesiska tillverkare av Taiko-väferringsskärningsmaskiner, leverantörer, fabrik

Product Description

Full Automatic Taiko Wafer Ring Cut Machine

This is a Taiko wafer ring cutting machine.
This model automates the entire wafer processing workflow—encompassing mounting, alignment, cutting, cleaning, UV tape release, and ring removal—thereby significantly reducing labor costs and enhancing production efficiency.

Workflow

Cutting Section: Removes the excessively thick outer rim of the wafer following the back-grinding process. While retaining the core functionality of the original DS9260 dicing saw, this section incorporates additional ring-cutting and mechanical calibration capabilities.
Debonding Section: Transfers the wafer—once cutting and cleaning are complete—into the UV irradiation unit.
Ring Removal Section: Retrieves the ring following UV irradiation and transports it to the designated ring storage location.

Equipment Principle — Ring Removal

Components:
1. Ring-cut Product
2. Ring-Lifting Wheel
3. Ring-Removal Station Ceramic Chuck
4. Ring-Removal Station Outer Ring Chuck
5. Center Chuck
6. Vacuum Sealing Ring
7. Outer Ring Vacuum Assist

Principle:

The product is positioned above the ceramic chuck at the ring-removal station. A positioning and alignment mechanism is utilized to ensure the product is concentric with the center chuck. Following vacuum adsorption, the outer ring chuck executes a vertical stroke to create a separation gap between the product and the UV film; throughout this process, the outer ring vacuum is continuously maintained via associated vacuum components. Subsequently, the ring-lifting wheels descend and insert themselves—working from the outside inward—into the interface between the product and the UV film. The three ring-lifting wheels then coordinate to rotate around the center axis through an arc of 120° to 130°, thereby detaching the outer ring of the product from the outer circumference of the film. Finally, the wheels lift upward to complete the ring-removal process.

Specification

Environment	Constant 20–25°C; Humidity <60% (non-condensing)
Power Supply	3-Phase, AC 220V/380V, 10 kW
Compressed Air	Pressure: 0.5–0.6 MPa; Max. Consumption: 700 L/min
Cooling Water	Pressure: 0.2–0.3 MPa; Max. Consumption: 3.0 L/min
Exhaust Air Volume	8.0 m³/min (ANR)
Dimensions (W × D × H)	1600 mm x 2325 mm x 1800 mm
Weight	3000 kg (excluding transformer)

Configuration and Performance	Processing Dimensions	Φ300，Φ200
		Product Types	1.2mm
		Maximum Workpiece Thickness	≤800um
		Worktable Flatness	0.010mm/Φ310mm

X-axis	Effective Travel	310mm
X-axis		Resolution	0.001mm
θ-axis	Rotation Angle Range	380°
θ-axis		Rotation Angle Resolution	0.0005°
Y-axis	Effective Travel	310mm
		Single-Step Positioning Accuracy	≤0.002/5mm
		Resolution	0.0001mm
Z-axis	Effective Travel	40 mm
		Maximum Blade Size	Φ58 mm
		Motion Resolution	0.0001 mm
		Repeatability	0.001 mm

Equipment Precision and Performance

Work Chuck Flatness	0.010 mm / Φ300 mm 0.008 mm / □250 mm
XY-Axis Perpendicularity	0.006 mm / 300 mm
Y-Axis Step Accuracy	0.002 mm / 5 mm (Single Step)
Spindle Flange-to-X-Axis Parallelism	0.001 mm / 30 mm
Z-Axis Repeatability	0.001 mm / 50 Cycles
Cutting Chuck-to-Lower Arm Parallelism	0.05 mm / 300 mm
Pre-alignment Stage-to-Cutting Chuck X-Axis Center Offset	≤0.5 mm
Lower Arm Calibration Block-to-Cutting Chuck Concentricity	≤0.5 mm
Ring Pick-up Chuck-to-Upper Arm Parallelism	≤0.05 mm
Upper Arm-to-Upper Arm Calibration Block Concentricity	≤0.1 mm
UV Shield Surface-to-Upper Arm Parallelism	≤0.1 mm
Ring Pick-up Arm-to-Work Chuck Parallelism	≤0.1 mm
Ring Pick-up Arm-to-Work Table Concentricity	≤0.3 mm

Packing & Delivery

Company Profile

Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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Taiko Wafer Ring Cut Machine